# US 2023/0057045 A1 · Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0057045 A1 - Document ID: US20230057045A1 - Status: Published application - Kind: A1 - Application number: 17/784,163 - Filed: 2020-12-09 - Published: 2023-02-23 - Earliest claimed: 2019-12-11 - Assignees: Mitsubishi Gas Chemical Company, Inc. - Applicants: Mitsubishi Gas Chemical Company, Inc. - Inventors: Shunsuke KATAGIRI; Takuya SUZUKI; Seiji SHIKA; Yune KUMAZAWA - Web page: https://patentgrep.com/patent/US20230057045A1 ## CPC - C07C 69/75: of acids with a six-membered ring - C07C 69/757: having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, [IMAGE cpc-sch-C07C-0958.gif] groups,[IMAGE cpc-sch-C07C-0959.gif] groups, or[IMAGE cpc-sch-C07C-0960.gif] in the acid moiety - C08G 73/12: Unsaturated polyimide precursors - C08L 79/085: {Unsaturated polyimide precursors} - H05K 1/0313: {Organic insulating material} - C07B 2200/07: Optical isomers - C07C 2601/14: The ring being saturated - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 3/389: {by the use of a coupling agent, e.g. silane} - H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer - H05K 2201/068: wherein the coefficient of thermal expansion is important - C07C: ACYCLIC OR CARBOCYCLIC COMPOUNDS - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C07B: GENERAL METHODS OF ORGANIC CHEMISTRY; APPARATUS THEREFOR (preparation of carboxylic acid esters by telomerisation C07C67/47; telomerisation C08F) ## Abstract A compound (A) of the present invention is represented by the formula (1): wherein each R1 independently represents a group represented by the formula (2) or a hydrogen atom, and each R2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R1 is a group represented by the formula (2); and wherein -* represents a bonding hand. ## Claims ### Claim 1 A compound represented by the following formula (17): ### Claim 2 (canceled) ### Claim 3 (depends on 1) A method for producing the compound according to claim 1, comprising a step of reacting an alcohol compound represented by the following formula (4) wherein each R3 independently represents an ethyl group. ### Claim 4 (canceled) ### Claim 5 (depends on 3) The production method according to claim 3, wherein the reaction is carried out in the absence of a catalyst. ### Claim 6 (depends on 3) The production method according to claim 3, wherein the reaction is performed in at least one solvent selected from the group consisting of a halogen solvent, a ketone solvent, and an ester solvent. ### Claim 7 (depends on 6) The production method according to claim 6, wherein the solvent is at least one selected from the group consisting of dichloromethane, methyl ethyl ketone, butyl acetate, γ-butyrolactone, and propylene glycol monomethyl ether acetate. ### Claim 8 A resin composition comprising a compound represented by the following formula (16) and/or a compound represented by the following formula (17): and a bismaleimide compound (B) comprising a constituent unit represented by the following formula (7) and maleimide groups at both ends of the molecular chain: wherein R4 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R5 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R6 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n1 independently represents an integer of 1 to 10. ### Claim 9 (canceled) ### Claim 10 (depends on 8) The resin composition according to claim 8, further comprising at least one maleimide compound (C) selected from the group consisting of a compound represented by the following formula (8), a compound represented by the following formula (9), a compound represented by the following formula (10), a compound represented by the following formula (11), a compound represented by the following formula (12), and a compound represented by the following formula (13): wherein R7, R8, and R9 each independently represent a hydrogen atom, or a linear or branched alkyl group having 1 to 8 carbon atoms and optionally having a substituent; wherein R10, R11, and R12 each independently represent a hydrogen atom, a hydroxyl group, or a linear or branched alkyl group having 1 to 6 carbon atoms and optionally having a substituent; and n2 is an integer of 1 to 10; wherein each R13 independently represents a hydrogen atom, a methyl group or an ethyl group, and each R14 independently represents a hydrogen atom or a methyl group; wherein each R15 independently represents a hydrogen atom or a methyl group; and n3 is an integer of 1 to 10; wherein each R16 independently represents a hydrogen atom, a methyl group or an ethyl group; and wherein each R17 independently represents a hydrogen atom or a methyl group; and n4 is an integer of 1 to 10. ### Claim 11 (depends on 8) The resin composition according to claim 8, further comprising a photo initiator (D). ### Claim 12 (depends on 11) The resin composition according to claim 11, wherein the photo initiator (D) comprises a compound represented by the following formula (14): wherein each R18 independently represents a group represented by the following formula (15) or a phenyl group; and wherein -* represents a bonding hand, and each R19 independently represents a hydrogen atom or a methyl group. ### Claim 13 (depends on 6) A resin sheet comprising: a support; and a resin layer disposed on one surface or both surfaces of the support, wherein the resin layer comprises the resin composition according to claim 6. ### Claim 14 (depends on 13) The resin sheet according to claim 13, wherein the resin layer has a thickness of 1 to 50 μm. ### Claim 15 (depends on 6) A multilayer printed wiring board comprising: an insulation layer; and a conductor layer formed on one surface or both surfaces of the insulation layer, wherein the conductor layer comprises the resin composition according to claim 6. ### Claim 16 (depends on 6) A semiconductor device comprising the resin composition according to claim 6.