# US 2023/0056971 A1 · Wiring board and method for manufacturing same

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- Number: US 2023/0056971 A1
- Document ID: US20230056971A1
- Status: Published application
- Kind: A1
- Application number: 17/789,353
- Filed: 2020-12-24
- Published: 2023-02-23
- Earliest claimed: 2019-12-27
- Assignees: Material Concept, Inc.
- Applicants: Material Concept, Inc.
- Inventors: Junichi KOIKE; Tri Hai HOANG
- Web page: https://patentgrep.com/patent/US20230056971A1

## CPC

- H05K 1/0277: {Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence)}
- H05K 3/38: Improvement of the adhesion between the insulating substrate and the metal
- H05K 1/0313: {Organic insulating material}
- H05K 1/092: {Dispersed materials, e.g. conductive pastes or inks}
- H05K 3/1283: {After-treatment of the printed patterns, e.g. sintering or curing methods}
- H05K 3/1291: {Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets}
- H05K 2201/0116: Porous, e.g. foam
- H05K 2201/2072: Anchoring, i.e. one structure gripping into another
- H05K 2203/016: Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
- H05K 2203/1131: Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Provided are: a novel wiring board having flexibility derived from a resin board and the high electrical conductivity derived from a metal wiring as well as high adhesion between the metal wiring and the insulating resin board; and a method for manufacturing the wiring board without using a photolithography process. A wiring board according to the present invention comprises a resin board and a metal wiring, the metal wiring including a sintered body of metal particles, the sintered body including a plurality of voids having opening portions extending toward the resin board, parts of the resin board entering the voids from the opening portions.

## Claims

### Claim 1

A wiring board comprising: a resin board and a metal wiring,
the metal wiring including a sintered body of metal particles,
the sintered body including a plurality of voids having opening portions extending toward the resin board,
parts of the resin board entering the voids from the opening portions.

### Claim 2 (depends on 1)

The wiring board according to claim 1, wherein the metal particles include one or more types selected from the group consisting of copper, silver, and nickel.

### Claim 3 (depends on 1)

The wiring board according to claim 1, having a void proportion of 1% by volume or more and 30% by volume or less.

### Claim 4 (depends on 1)

The wiring board according to claim 1, wherein parts of the voids are connected to each other and parts of the resin board having entered the voids from the opening portions are connected to each other.

### Claim 5 (depends on 1)

The wiring board according to claim 1, wherein a resin surface layer is formed on a surface of the sintered body, the surface being located on a side opposite to a boundary interface in contact with the resin board.

### Claim 6

A method for manufacturing a wiring board including a resin board and a metal wiring containing a sintered body of metal particles, the method comprising:
forming the sintered body on a sintering member,
applying, on the sintering member, a solution including a resin component to a surface of the sintered body and around the sintered body,
curing the resin component to form the resin board; and
separating the sintered body and the resin board from the sintering member.

### Claim 7 (depends on 6)

The method for manufacturing a wiring board according to claim 6, wherein the solution includes a precursor substance for the resin or a polymerizable monomer of the resin.

### Claim 8

A method for manufacturing a wiring board including a resin board and a metal wiring containing a sintered body of metal particles, the method comprising:
providing the resin board; and
forming the sintered body on the resin board.

### Claim 9 (depends on 8)

The method for manufacturing a wiring board according to claim 8, the method comprising: applying a solution including a resin component on the resin board and curing the resin component to form an interface resin layer, wherein the forming the sintered body includes forming the sintered body on the interface resin layer.

### Claim 10 (depends on 9)

The method for manufacturing a wiring board according to claim 9, wherein the solution includes a precursor substance of a resin or a polymerizable monomer of a resin.