# US 2023/0056722 A1 · Power module with improved electrical and thermal characteristics

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- Number: US 2023/0056722 A1
- Document ID: US20230056722A1
- Status: Published application
- Kind: A1
- Application number: 17/785,091
- Filed: 2020-12-18
- Published: 2023-02-23
- Earliest claimed: 2019-12-28
- Applicants: Danfoss Silicon Power GmbH
- Inventors: Jörg BERGMANN; Henning STRÖBEL-MAIER
- Web page: https://patentgrep.com/patent/US20230056722A1

## CPC

- H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)}
- H05K 1/181: associated with surface mounted components
- H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 90/00: Package configurations
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H05K 2201/10166: Transistor
- H10W 70/658: {for devices provided for in groups H10D8/00 - H10D48/00}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/5473: {multiple bond wires connected to a common bond pad}
- H10W 72/5475: {multiple bond wires connected to common bond pads at both ends of the wires}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A power module (1) includes a group of at least three rectangular electrical power components (11, 12, 13, 14, 23, 24, 25, 26) arranged on a substrate (2), wherein in that at least one side (31) of at least one of the rectangular electrical power components (11, 14) is not orthogonal or parallel to a line (3) that passes through the geometric centres of the remaining rectangular electrical power components (12, 13) of the group.

## Claims

### Claim 1

A power module comprising a group of at least three rectangular electrical power components arranged on a substrate, wherein in that at least one side of at least one of the rectangular electrical power components is not orthogonal or parallel to a line that passes through the geometric centres of the remaining rectangular electrical power components of the group.

### Claim 2 (depends on 1)

The power module according to claim 1, wherein the geometric centres of all of the rectangular electrical power components that comprise the group are disposed along a straight line.

### Claim 3 (depends on 1)

The power module according to claim 1, wherein the group of rectangular electrical power components are electrically connected in parallel.

### Claim 4 (depends on 1)

The power module according to claim 1, wherein the rectangular electrical power components are semiconductor switches.

### Claim 5 (depends on 4)

The power module according to claim 4, wherein the power module provides a half bridge circuit.

### Claim 6 (depends on 5)

The power module according to claim 5, wherein the substrate further comprises an inner load track, two intermediate load tracks and two outer load tracks, each of which load tracks is elongated and extends substantially across the substrate in a first direction;
wherein the two intermediate load tracks are arranged adjacent to the inner load track, and each outer load track is arranged on the opposite side of one of the two intermediate load tracks to that of the inner load track with respect to a second direction substantially orthogonal to the first direction;
wherein the power module comprises two first sets of semiconductor switches, each first set of semiconductor switches being mounted on the inner load track and electrically connected to an intermediate load track, such that the first sets of semiconductor switches form a first arm of the half bridge circuit;
wherein the power module comprises two second sets of semiconductor switches, each second set of semiconductor switches being mounted on an intermediate load track and electrically connected to an outer load track, such that the second sets of semiconductor switches form a second arm of the half bridge circuit.

### Claim 7 (depends on 4)

The power module according to claim 4, wherein the external DC power terminals are arranged at one end of the module in the first direction, and one or more AC power terminals are arranged at the opposite end of the module in the first direction.

### Claim 8 (depends on 1)

The power module according to claim 1, wherein the angle between a side of at least one of the rectangular electronic power components and a line that passes through the geometric centres of the remaining rectangular electrical power components of the group is within the range 30-60°.

### Claim 9 (depends on 1)

The power module according to claim 1, wherein the angle between a side of at least one of the rectangular electronic power components and a line that passes through the geometric centres of the remaining rectangular electrical power components of the group is 45°.