# US 2023/0056550 A1 · Semiconductor package structure including antenna

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- Number: US 2023/0056550 A1
- Document ID: US20230056550A1
- Status: Published application
- Kind: A1
- Application number: 18/046,218
- Filed: 2022-10-13
- Published: 2023-02-23
- Earliest claimed: 2019-08-01
- Assignees: Mediatek Inc.
- Applicants: Mediatek Inc.
- Inventors: Yen-Yao CHI; Nai-Wei LIU; Tzu-Hung LIN
- Web page: https://patentgrep.com/patent/US20230056550A1

## CPC

- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H05K 1/165: {incorporating printed inductors}
- H05K 1/181: associated with surface mounted components
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- H10W 44/241: {for passive devices or passive elements}
- H10W 44/248: {for antennas}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/63: Vias, e.g. via plugs
- H10W 70/6528: {of the portions that connect to chips, wafers or package parts}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/9413: {on encapsulations}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

An electronic device that has an antenna device that includes a conductive pattern layer comprising a first antenna element, the conductive pattern layer formed in an insulating substrate and adjacent to a first surface of the insulating substrate, and a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The electronic device further has a semiconductor package that includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer, a first electronic component electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first electronic component.

## Claims

### Claim 1

An electronic device, comprising:
an antenna device, comprising:
a conductive pattern layer comprising a first antenna element, the conductive pattern layer formed in an insulating substrate and adjacent to a first surface of the insulating substrate; and
a second antenna element formed on a second surface of the insulating substrate opposite the first surface; and
a semiconductor package, comprising:
a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer;
a first electronic component electrically connected to the RDL structure; and
an encapsulating layer formed on the RDL structure and surrounding the first electronic component.

### Claim 2 (depends on 1)

The electronic device as claimed in claim 1, further comprising:
a plurality of first electrical connectors bonding the RDL structure to the conductive pattern layer, so that the conductive pattern layer is separated from the RDL structure by a gap; and
a plurality of second electrical connectors electrically connected to the conductive pattern layer and surrounding the semiconductor package.

### Claim 3 (depends on 2)

The electronic device as claimed in claim 2, wherein the plurality of first electrical connectors and the plurality of second electrical connectors are solder balls, wherein the solder balls of the first electrical connectors are a different size than the solder balls of the second electrical connectors.

### Claim 4 (depends on 2)

The electronic device as claimed in claim 2, further comprising:
a passive device formed in the gap between the conductive pattern layer and the RDL structure and electrically connected to the RDL structure.

### Claim 5 (depends on 2)

The electronic device as claimed in claim 2, further comprising:
a passive device electrically connected to the conductive pattern layer and between the semiconductor package and at least one of the second electrical connectors.

### Claim 6 (depends on 5)

The electronic device as claimed in claim 5, wherein the plurality of first electrical connectors has a height that is less than a height of the passive device.

### Claim 7 (depends on 1)

The electronic device as claimed in claim 1, wherein the semiconductor package further comprises:
a second electronic component electrically connected to the RDL structure and surrounded by the encapsulating layer, wherein the second electronic component is a different size than the first electronic component.

### Claim 8 (depends on 1)

The electronic device as claimed in claim 1, wherein the semiconductor package further comprises:
a second electronic component electrically connected to the RDL structure and surrounded by the encapsulating layer, wherein a functional circuit of the second electronic component is different than a functional circuit of the first electronic component.

### Claim 9 (depends on 1)

The electronic device as claimed in claim 1, wherein the antenna device further comprises:
at least one through-via structure formed in the insulating substrate and electrically connecting the first antenna element and the second antenna element.

### Claim 10

An electronic device, comprising:
a redistribution (RDL) structure having a first surface and a second surface opposite the first surface;
a first electronic component having an active surface formed on the first surface of the RDL structure;
a plurality of first electrical connectors formed on the second surface of the RDL structure;
an insulating substrate having a first surface stacked on the second surface of the RDL structure;
a conductive pattern layer comprising a first antenna element, formed in the insulating substrate and adjacent to the first surface of the insulating substrate;
a second antenna element formed on a second surface of the insulating substrate opposite the first surface of the insulating substrate; and
a plurality of second electrical connectors formed on the first surface of the insulating substrate and electrically connected to the first antenna element, wherein the plurality of second electrical connectors is larger than the plurality of first electrical connectors.

### Claim 11 (depends on 10)

The electronic device as claimed in claim 10, wherein the plurality of first electrical connectors and the plurality of second electrical connectors are solder balls.

### Claim 12 (depends on 10)

The electronic device as claimed in claim 10, further comprising:
a passive device formed between two adjacent first electrical connectors of the first electrical connectors and electrically connected to the RDL structure.

### Claim 13 (depends on 10)

The electronic device as claimed in claim 10, further comprising:
a passive device electrically connected to the conductive pattern layer and between at least one of the first electrical connectors and at least one of the second electrical connectors.

### Claim 14 (depends on 13)

The electronic device as claimed in claim 13, wherein the plurality of first electrical connectors has a height that is less than the height of the passive device.

### Claim 15 (depends on 10)

The electronic device as claimed in claim 10, further comprising:
an encapsulating layer formed on the first surface of the RDL structure and surrounding the first electronic component.

### Claim 16 (depends on 10)

The electronic device as claimed in claim 10, further comprising:
a second electronic component having an active surface formed on the first surface of the RDL structure; and
an encapsulating layer formed on the first surface of the RDL structure and between and surrounding the first electronic component and the second electronic component.

### Claim 17 (depends on 16)

The electronic device as claimed in claim 16, wherein the second electronic component is a different size than the first electronic component.

### Claim 18 (depends on 16)

The electronic device as claimed in claim 16, wherein a functional circuit of the second electronic component is different than a functional circuit of the first electronic component.

### Claim 19 (depends on 10)

The electronic component as claimed in claim 10, further comprising:
at least one through-via structure formed in the insulating substrate and electrically connecting the first antenna element and the second antenna element.

### Claim 20 (depends on 10)

The electronic component as claimed in claim 10, wherein the plurality of first electrical connectors electrically connects between the RDL structure and the conductive pattern layer.