# US 2023/0056094 A1 · Display module and electronic device including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0056094 A1 - Document ID: US20230056094A1 - Status: Published application - Kind: A1 - Application number: 17/954,745 - Filed: 2022-09-28 - Published: 2023-02-23 - Earliest claimed: 2021-08-23 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Jaewan KIM; Junghyun KIM; Sangheon PARK; Gyudong EOM; Dongseop LEE - Web page: https://patentgrep.com/patent/US20230056094A1 ## CPC - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H01R 12/62: connecting to rigid printed circuits or like structures - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - H10K 59/82: Interconnections, e.g. terminals (H10K59/131, H10K59/179 take precedence) - H10W 70/611: {for connecting multiple chips together} - H10W 70/65: Shapes or dispositions of interconnections - H10W 72/30: Die-attach connectors - H05K 1/148: {Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means} - H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads} - H05K 3/365: {by abutting, i.e. without alloying process} - H05K 2201/049: PCB for one component, e.g. for mounting onto mother PCB - H05K 2201/09409: Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components - H05K 2201/09445: Pads for connections not located at the edge of the PCB, e.g. for flexible circuits - H05K 2201/10128: Display - H05K 2201/10727: Leadless chip carrier [LCC], e.g. chip-modules for cards - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10W 70/688: {Flexible insulating substrates} - H10W 72/327: {Multiple die-attach connectors having different sizes} - H10W 72/90: Bond pads, in general - H10W 72/9415: {relative to the surface, e.g. recessed, protruding} - H10W 90/00: Package configurations - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic device is provided. The electronic device includes a display panel, a first connection member on which a display driver integrated circuit (DDIC) configured to control the display panel is disposed, a first contact point part disposed on the first connection member, a second contact point part spaced apart from the first contact point part in a second direction perpendicular to the first direction and disposed on the first contact point part, a second connection member disposed adjacent to the first connection member, a third contact point part arranged in the first direction and is disposed on the first layer of the second connection member to be connected to the first contact point part, and a fourth contact point part arranged in the first direction and is arranged on the second layer of the second connection member to be connected to the second contact point part. ## Claims ### Claim 1 An electronic device comprising: a display panel; a first connection member which comprises multiple wires electrically connected to the display panel and on which a display driver integrated circuit (DDIC) configured to control the display panel is disposed; a first contact point part which comprises multiple first pads electrically connected to some of the wires included in the first connection member and arranged in a first direction and is disposed on the first connection member; a second contact point part which comprises multiple second pads electrically connected to other wires included in the first connection member and arranged in the first direction and is spaced apart from the first contact point part in a second direction perpendicular to the first direction and disposed on the first connection member; a second connection member which comprises a first layer, a second layer laminated on the first layer, and multiple wires arranged on each of the layers and is disposed adjacent to the first connection member; a third contact point part which comprises multiple third pads electrically connected to some of the wires included in the second connection member and arranged in the first direction and is disposed on the first layer of the second connection member to be connected to the first contact point part; and a fourth contact point part which comprises multiple fourth pads electrically connected to other wires included in the second connection member and arranged in the first direction and is arranged on the second layer of the second connection member to be connected to the second contact point part. ### Claim 2 (depends on 1) The electronic device of claim 1, wherein the first connection member is integrally formed with a substrate of the display panel. ### Claim 3 (depends on 1) The electronic device of claim 1, wherein widths of the first pads and the second pads formed on the first connection member are smaller than widths of the third pads and the fourth pads formed on the second connection member. ### Claim 4 (depends on 1) The electronic device of claim 1, further comprising: a conductive member which comprises: a first conductive member disposed between the first contact point part and the third contact point part and configured to electrically connect the first pads and the third pads, and a second conductive member disposed between the second contact point part and the fourth contact point part and configured to electrically connect the second pads and the fourth pads. ### Claim 5 (depends on 4) The electronic device of claim 4, wherein the first conductive member of the conductive member comprises a first conductive ball, wherein the second conductive member of the conductive member comprises a second conductive ball, and wherein a diameter of the first conductive ball is larger than a diameter of the second conductive ball. ### Claim 6 (depends on 1) The electronic device of claim 1, wherein the first connection member is formed separately from a substrate of the display panel and is electrically connected to the substrate of the display panel. ### Claim 7 (depends on 6) The electronic device of claim 6, wherein the first connection member comprises laminated multiple layers, and wherein the first pads and the second pads are respectively arranged on different layers among the multiple layers of the first connection member. ### Claim 8 (depends on 1) The electronic device of claim 1, wherein the first pads and the second pads are portions configured to allow a part of each of the multiple wires included in the first connection member to be exposed therethrough, and wherein the third pads and the fourth pads are portions configured to allow a part of each of the multiple wires included in the second connection member to be exposed therethrough. ### Claim 9 (depends on 1) The electronic device of claim 1, wherein the first connection member and the second connection member are formed of a flexible material. ### Claim 10 (depends on 1) The electronic device of claim 1, wherein the first connection member has at least a portion bent to allow the first connection member to extend to a rear surface of the display panel. ### Claim 11 A display module comprising: a display panel; a first connection member which comprises multiple wires electrically connected to the display panel and on which a display driver integrated circuit (DDIC) configured to control the display panel is disposed; a first contact point part which comprises multiple first pads electrically connected to some of the wires included in the first connection member and arranged in a first direction and is disposed on the first connection member; a second contact point part which comprises multiple second pads electrically connected to other wires included in the first connection member and arranged in the first direction and is spaced apart from the first contact point part in a second direction perpendicular to the first direction and disposed on the first connection member; a second connection member which comprises a first layer, a second layer laminated on the first layer, and multiple wires arranged on each of the layers and is disposed adjacent to the first connection member; a third contact point part which comprises multiple third pads electrically connected to some of the wires included in the second connection member and arranged in the first direction and is disposed on the first layer of the second connection member to be connected to the first contact point part; and a fourth contact point part which comprises multiple fourth pads electrically connected to other wires included in the second connection member and arranged in the first direction and is arranged on the second layer of the second connection member to be connected to the second contact point part. ### Claim 12 (depends on 11) The display module of claim 11, wherein the first connection member is integrally formed with a substrate of the display panel. ### Claim 13 (depends on 11) The display module of claim 11, wherein widths of the first pads and the second pads formed on the first connection member are smaller than widths of the third pads and the fourth pads formed on the second connection member. ### Claim 14 (depends on 11) The display module of claim 11, further comprising: a conductive member which comprises: a first conductive member disposed between the first contact point part and the third contact point part and configured to electrically connect the first pads and the third pads, and a second conductive member disposed between the second contact point part and the fourth contact point part and configured to electrically connect the second pads and the fourth pads. ### Claim 15 (depends on 14) The display module of claim 14, wherein the first conductive member of the conductive member comprises a first conductive ball, wherein the second conductive member of the conductive member comprises a second conductive ball, and wherein a diameter of the first conductive ball is larger than a diameter of the second conductive ball. ### Claim 16 (depends on 11) The display module of claim 11, wherein the first connection member is formed separately from a substrate of the display panel and is electrically connected to the substrate of the display panel. ### Claim 17 (depends on 16) The display module of claim 16, wherein the first connection member comprises laminated multiple layers, and wherein the first pads and the second pads are respectively arranged on different layers among the multiple layers of the first connection member. ### Claim 18 (depends on 11) The display module of claim 11, wherein the first pads and the second pads are portions configured to allow a part of each of the multiple wires included in the first connection member to be exposed therethrough, and wherein the third pads and the fourth pads are portions configured to allow a part of each of the multiple wires included in the second connection member to be exposed therethrough. ### Claim 19 (depends on 11) The display module of claim 11, wherein the first connection member has at least a portion bent to allow the first connection member to extend to a rear surface of the display panel. ### Claim 20 An electronic device comprising: a display panel; a first connection member which comprises multiple wires electrically connected to the display panel and on which a display driver integrated circuit (DDIC) configured to control the display panel is disposed; and a second connection member which comprises a first layer, a second layer laminated on the first layer, and multiple wires arranged on each of the layers and is disposed adjacent to the first connection member, wherein the first connection member comprises: a first contact point part which comprises multiple first pads electrically connected to some of the wires included in the first connection member and arranged in a first direction and is disposed on the first connection member, and a second contact point part which comprises multiple second pads electrically connected to other wires included in the first connection member and arranged in the first direction and is spaced apart from the first contact point part in a second direction perpendicular to the first direction and disposed on the first connection member, and wherein the second connection member comprises: a third contact point part which comprises multiple third pads electrically connected to some of the wires included in the second connection member and arranged in the first direction and is disposed on the first layer of the second connection member and connected to the first contact point part, and a fourth contact point part which comprises multiple fourth pads electrically connected to other wires included in the second connection member and arranged in the first direction and is arranged on the second layer of the second connection member and connected to the second contact point part.