# US 2023/0055151 A1 · Thermal interface layer

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- Number: US 2023/0055151 A1
- Document ID: US20230055151A1
- Status: Published application
- Kind: A1
- Application number: 17/792,815
- Filed: 2021-01-14
- Published: 2023-02-23
- Earliest claimed: 2020-01-22
- Assignees: 3M Innovative Properties Company
- Applicants: 3M Innovative Properties Company
- Inventors: Samuel J. Carpenter; Aaron K. Nienaber; Joseph B. Eckel; Ronald D. Jesme; Jacob P. Podkaminer; Victor Ho; Sebastian Goris; Matthew T. Johnson; Michael S. Graff; Steven H. Kong
- Web page: https://patentgrep.com/patent/US20230055151A1

## CPC

- H10W 40/257: {having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence)}
- H10W 40/251: {Organics}
- H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A thermal interface layer includes pluralities of first and second particles dispersed in a polymeric binder at a total loading V in a range of about 40 volume percent to about 70 volume percent. The first and second particles have different compositions. The first particles include one or more of iron or nickel. The second particles include one or more of aluminum, magnesium, silicon, copper, or zinc. The thermal interface layer has a thermal conductivity in a thickness direction of the thermal interface layer in units of W/mK of at least K=5.1−0.17 V+0.002 V2.

## Claims

### Claim at position 1

1-15. (canceled)

### Claim 16

A thermal interface layer comprising pluralities of first and second particles dispersed in a polymeric binder at a total loading V in a range of about 40 volume percent to about 70 volume percent, the first and second particles having different compositions, the first particles comprising one or more of iron or nickel, the second particles comprising one or more of aluminum, magnesium, silicon, copper, or zinc, wherein the thermal interface layer has a thermal conductivity in a thickness direction of the thermal interface layer in units of W/mK of at least K=5.1-0.17 V+0.002 V2.

### Claim 17 (depends on 16)

The thermal interface layer of claim 16, wherein a ratio of a total volume of the first particles to a total volume of the first and second particles is in a range of about 0.04 to about 0.1.

### Claim 18 (depends on 16)

The thermal interface layer of claim 16, wherein the first particles comprise flakes.

### Claim 19 (depends on 16)

The thermal interface layer of claim 16, wherein the second particles comprise at least one of substantially spherical particles, substantially spheroidal particles, or substantially spheroidal particles.

### Claim 20

A thermal interface layer comprising pluralities of first and second particles at a total volume loading in a range of about 40 percent to about 70 percent, a ratio of a total volume of the first particles to a total volume of the first and second particles being in a range of about 0.04 to about 0.1, the first and second particles having respective real parts of relative magnetic permeability μ′1 and μ′2 such that for at least one frequency less than about 1 GHz, μ′1/μ′2≥5, wherein the second particles are at least partially aligned so as to increase a thermal conductivity of the thermal interface layer in a thickness direction of the thermal interface layer by at least 10 percent.

### Claim 21 (depends on 20)

The thermal interface layer of claim 20, wherein the second particles have a multimodal particle size distribution.

### Claim 22 (depends on 20)

The thermal interface layer of claim 20, wherein the total volume loading of the first and second particles is less than about 55 percent.

### Claim 23 (depends on 20)

The thermal interface layer of claim 20, wherein a total volume loading of the first particles in the thermal interface layer is in a range of about 2.5 percent to about 10 percent.

### Claim 24 (depends on 20)

The thermal interface layer of claim 20, wherein the total volume of the first and second particles is V, and wherein the thermal conductivity of the thermal interface layer in the thickness direction of the thermal interface layer in units of W/mK is at least K=5.1−0.17 V+0.002 V2.

### Claim 25

A thermal interface layer comprising a plurality of alternating substantially continuous layers of magnetically responsive first and thermally conductive second particles, the alternating layers generally extending along orthogonal first and second directions and arranged along a third direction, the first and second particles having different compositions, the second particles having a thermal conductivity of at least 10 W/mK.

### Claim 26 (depends on 25)

The thermal interface layer of claim 25, wherein the first and second particles have respective real parts of relative permeability μ′1 and μ′2 such that for at least one frequency less than about 1 GHz, μ′1/μ′2≥5.

### Claim 27 (depends on 25)

The thermal interface layer of claim 25 having opposing first and second major surfaces spaced apart a distance D along a thickness direction of the thermal interface layer, wherein each layer has a length L along the first direction from a first to an opposing second edge of the thermal interface layer, L/D≥100.

### Claim 28 (depends on 27)

The thermal interface layer of claim 27, wherein the thickness direction is substantially parallel to the second direction.

### Claim 29 (depends on 27)

The thermal interface layer of claim 27, wherein the plurality of first particles comprise a plurality of first flakes, each first flake extending generally along orthogonal first and second directions defining a plane of the first flake, each first flake in at least a majority of the first flakes being oriented such that the plane of the first flake makes an angle of less than 40 degrees with the thickness direction of the thermal interface layer, the first particles causing the second particles to at least partially align.

### Claim 30 (depends on 25)

The thermal interface layer of claim 25, wherein the first and second particles are dispersed in a polymeric matrix, the polymeric matrix comprising at least 50 percent by volume of the thermal interface layer.

### Claim 31 (depends on 30)

The thermal interface layer of claim 30, wherein the polymeric matrix has a porosity of at least 20 percent.

### Claim 32 (depends on 25)

The thermal interface layer of claim 25, wherein a volume of the first and second particles is V, and wherein a thermal conductivity of the thermal interface layer in a thickness direction of the thermal interface layer in units of W/mK is at least K=5.1−0.17 V+0.002 V2.