# US 2023/0055030 A1 · Basic structural body for constructing heat dissipation device and heat dissipation device

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- Number: US 2023/0055030 A1
- Document ID: US20230055030A1
- Status: Published application
- Kind: A1
- Application number: 17/897,205
- Filed: 2022-08-28
- Published: 2023-02-23
- Earliest claimed: 2018-12-11
- Assignees: Asia Vital Components Co., Ltd.
- Applicants: Asia Vital Components Co., Ltd.
- Inventors: Kuei-Feng Chiang
- Web page: https://patentgrep.com/patent/US20230055030A1

## CPC

- F28D 15/043: {forming loops, e.g. capillary pumped loops}
- B23P 15/26: heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)}
- C23C 18/31: Coating with metals
- C23C 24/08: by application of heat or pressure and heat (C23C24/04 takes precedence)
- C25D 1/00: Electroforming
- C25D 7/00: Electroplating characterised by the article coated
- F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)}
- F28D 15/0266: {with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence)}
- F28D 15/06: Control arrangements therefor
- F28F 21/04: of ceramic; of concrete; of natural stone
- F28F 21/065: {the heat-exchange apparatus employing plate-like or laminated conduits}
- H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps}
- H10W 40/73: for cooling by change of state
- B33Y 80/00: Products made by additive manufacturing
- F28D 15/046: {characterised by the material or the construction of the capillary structure}
- F28F 21/083: {from stainless steel}
- F28F 21/084: {from aluminium or aluminium alloys}
- F28F 21/085: {from copper or copper alloys}
- F28F 21/086: {from titanium or titanium alloys}
- F28F 21/087: {from nickel or nickel alloys}
- H10W 40/251: {Organics}
- H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H10W 40/259: {Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general)
- B23P: METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS (arrangements for copying or controlling B23Q)
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING

## Abstract

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

## Claims

### Claim 1

A heat dissipation device, comprising:
a plurality of first basic structural bodies, which respectively have a wick structure formed on one side surface thereof; the first basic structural body and the wick structure thereof being structural bodies formed layer by layer, and the basic structural bodies being correspondingly closed together in pairs to construct the heat dissipation device that internally defines an airtight chamber; and a working fluid being filled in the airtight chamber.

### Claim 2 (depends on 1)

The heat dissipation device as claimed in claim 1, wherein the first basic structural body is formed using a material selected from the group consisting gold, silver, copper, aluminum, titanium, stainless steel, ceramic, non-metal materials, and any combination thereof.

### Claim 3 (depends on 1)

The heat dissipation device as claimed in claim 1, wherein the heat dissipation device has an outlet and an inlet, which are connected to two opposite ends of a vapor and liquid pipe that is extended through a heat dissipation unit; and the vapor and liquid pipe and the heat dissipation unit being structural bodies formed layer by layer through 3D printing.

### Claim 4 (depends on 1)

The heat dissipation device as claimed in claim 1, wherein the wick structure is selected from the group consisting of a structural layer including one single porous body, a structural layer including a plurality of superimposed porous bodies, and a plurality of grooves formed between mutually spaced ribs; and is formed through a manner selected from the group consisting of 3D printing, electroforming, electroplating, printing, and thermal spraying; and the porous body being selected from the group consisting of a powder-sintered body, a woven mesh, a fibrous member, and a structural body combining superimposed layers of powder-sintered body, woven mesh and fibrous member.

### Claim 5 (depends on 1)

The heat dissipation device as claimed in claim 1, wherein the wick structure is formed using a material selected from the group consisting of copper, aluminum, nickel, gold, silver, titanium, stainless steel, ceramic, plastic, and any combination thereof.

### Claim 6 (depends on 1)

The heat dissipation device as claimed in claim 1, further comprising a polymeric layer externally provided on one side of the heat dissipation device opposite to the wick structure; the polymeric layer being formed using a material selected from the group consisting of a natural polymer, a synthetic polymer and an inorganic polymer; the natural polymer being selected from the group consisting of starch, rubber and nucleic acid; the synthetic polymer being selected from the group consisting of polyethylene (PE), polyvinyl chloride (PVC), nylon, Dacron (polyethylene terephthalate or PET), acrylonitrile butadiene styrene (ABS), and styrene-butadiene rubber (SBR); and the inorganic polymer being selected from the group consisting of quartz, asbestos, mica and graphite.