# US 2023/0054846 A1 · Laminated Component Carrier With a Thermoplastic Structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0054846 A1 - Document ID: US20230054846A1 - Status: Published application - Kind: A1 - Application number: 18/045,376 - Filed: 2022-10-10 - Published: 2023-02-23 - Earliest claimed: 2016-03-30 - Assignees: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft - Applicants: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft - Inventors: Thomas KRIVEC - Web page: https://patentgrep.com/patent/US20230054846A1 ## CPC - H05K 1/0278: {Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material} - H05K 1/181: associated with surface mounted components - H05K 3/0014: {Shaping of the substrate, e.g. by moulding} - H05K 3/4655: {by using a laminate characterized by the insulating layer (general-purpose insulating materials H05K1/03, H05K3/4673)} - H05K 3/4688: {Composite multilayer circuits, i.e. comprising insulating layers having different properties (having a special base or central core H05K3/4602)} - H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers} - H05K 1/0284: {Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)} - H05K 1/036: {Multilayers with layers of different types} - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer - H05K 2203/1105: Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating - H05K 2203/302: Bending a rigid substrate; Breaking rigid substrates by bending - H10W 70/63: Vias, e.g. via plugs - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided. ## Claims ### Claim 1 A component carrier for carrying at least one electronic component, the component carrier comprising: a plurality of electrically conductive layers, a plurality of electrically insulating layers forming thermosetting structures, and a thermoplastic structure comprising a thermoplastic material; wherein the electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate, wherein the thermosetting structure comprises a thermosetting material; wherein the thermosetting structure is formed over and/or under the thermoplastic structure, and wherein, with respect to a main plane being oriented parallel to the layers of the laminate, the thermosetting structure comprises a smaller size than the thermoplastic structure. ### Claim 2 (depends on 1) The component carrier of claim 1, wherein within a main plane there is at least one exposed portion in which only the thermoplastic structure and not the thermosetting structure is provided. ### Claim 3 (depends on 1) The component carrier as set forth in claim 1, wherein the thermoplastic structure forms a core layer. ### Claim 4 (depends on 1) The component carrier as set forth in claim 1, wherein the thermoplastic material is included in a composite layer structure. ### Claim 5 (depends on 1) The component carrier as set forth in claim 1, wherein the thermoplastic structure is a core laminate comprising a layer of the thermoplastic material which is sandwiched by two electrically conductive layers. ### Claim 6 (depends on 1) The component carrier as set forth in claim 1, wherein the thermoplastic material is a semi-crystalline material or an amorphous material. ### Claim 7 (depends on 1) The component carrier as set forth in claim 1, wherein the thermoplastic material comprises at least one of the group consisting of Polyolefins such as Polypropylene (PP), Vinyl-Polymers such as PVC, Styrene based Polymers such as Polystyrene (PS), Polyacrylates such as Polymethylmetaclylate (PMMA), Polyacetals such as Polyoxymetlylene (POM), Fluoropolymers such as Polytetrafluoroethylene (PTFE), Polyamides including aromatic polyamides such as Polyphthalamide (PPA), Polycarbonate (PC) and Derivatives, Polyesters such as Polyethylene terephthalate (PET), Liquid Crystalline Polymers (LCP), Polyarylether such as Polyphenyleneether (PPE), Polyphenylenesulfone (PSU), Polyphenylenesulfone (PSU), Polyarylethersulfone (PES), Polyphenylensulfid (PPS), Polyetherketones such as Polyetheretherketone (PEEK), Polyimide (PI), Polyetherimide (PEI), Polyamidimide (PAI). ### Claim 8 An electronic apparatus, comprising: a component carrier including: a plurality of electrically conductive layers, a plurality of electrically insulating layers forming thermosetting structures, and a thermoplastic structure comprising a thermoplastic material; wherein the electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate, wherein the thermosetting structure comprises a thermosetting material; wherein the thermosetting structure is formed over and/or under the thermoplastic structure, and wherein, with respect to a main plane being oriented parallel to the layers of the laminate, the thermosetting structure comprises a smaller size than the thermoplastic structure. ### Claim 9 (depends on 8) The electronic apparatus of claim 8, further comprising: a housing structure, wherein the component carrier forms at least a part of the housing structure. ### Claim 10 A method for manufacturing a component carrier, the method comprising: forming a laminated stack including a plurality of electrically conductive layers, a plurality of electrically insulating layers forming thermosetting structures, and a thermoplastic structure comprising a thermoplastic material, wherein the thermosetting structure comprises a thermosetting material over and/or under the thermoplastic structure, wherein, with respect to a main plane being oriented parallel to the layers of the laminate, the thermosetting structure comprises a smaller size than the thermoplastic structure, wherein within the main plane there is at least one exposed portion in which only the thermoplastic structure and not the thermosetting structure is provided. ### Claim 11 (depends on 10) The method as set forth in claim 10, wherein forming the laminated stack comprises providing a core laminate including a layer of the thermoplastic material and two electrically conductive layers sandwiching the thermoplastic material, forming the remaining electrically conductive layers and the remaining electrically insulating layers over and/or under the core laminate, and creating at least one exposed portion of the layer of the thermoplastic material. ### Claim 12 (depends on 11) The method as set forth in claim 11, further comprising: heating up the at least one exposed portion, and bending the laminated stack within the at least one exposed portion. ### Claim 13 (depends on 11) The method as set forth in claim 11, further comprising: assembling active and/or passive electronic components onto the laminated stack such that they are electrically connected to the electrically conductive layers which are provided at the outside of the laminated stack; heating up the at least one exposed portion, and bending the laminated stack within the at least one exposed portion. ### Claim 14 (depends on 11) The method as set forth in claim 11, further comprising: forming the thermosetting structure comprising the thermosetting material at the core laminate at core portions being different from the at least one exposed portion. ### Claim 15 (depends on 14) The method as set forth in claim 14, wherein forming the thermosetting structure comprises forming a release layer at the at least one exposed portion, and forming the thermosetting structure also in at least one region corresponding to the at least one exposed portion; and removing, within the at least one region, the thermosetting structure and in particular the release layer together with the thermosetting structure. ### Claim 16 (depends on 15) The method as set forth in claim 15, wherein removing, within the at least one region, the thermosetting structure comprises forming, along at least one line encompassing the at least one region, a trench within the thermosetting structure such that a cut out of the thermosetting structure is formed; and removing the cut out from the core laminate.