# US 2023/0054844 A1 · Ink composition, product, liquid resin composition, and produced matter > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0054844 A1 - Document ID: US20230054844A1 - Status: Published application - Kind: A1 - Application number: 17/759,483 - Filed: 2021-01-22 - Published: 2023-02-23 - Earliest claimed: 2020-01-27 - Assignees: Shoei Chemical Inc. - Applicants: Shoei Chemical Inc. - Inventors: Paul TYRELL - Web page: https://patentgrep.com/patent/US20230054844A1 ## CPC - C09D 11/033: characterised by the solvent - C09D 11/03: characterised by features other than the chemical nature of the binder - C09D 11/037: characterised by the pigment - C09D 11/322: Pigment inks - C09D 11/36: based on non-aqueous solvents - C09D 11/38: characterised by non-macromolecular additives other than solvents, pigments or dyes - C09D 11/52: Electrically conductive inks - C09K 11/025: {non-luminescent particle coatings or suspension media} - C09K 11/08: containing inorganic luminescent materials - C09K 11/70: containing phosphorus - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE ## Abstract An ink composition according to an embodiment of the present invention, comprising: a volatile solvent; and dispersed in the volatile solvent, a plurality of semiconductor nanoparticles each coordinated to a plurality of organic ligands, wherein a ratio by mass of the semiconductor nanoparticles to the volatile solvent is greater than 1:1. A product according to an embodiment of the present invention comprising: a solid substrate; and arranged on the solid substrate, a dried residue of an ink composition, the dried residue comprising a plurality of semiconductor nanoparticles arranged without an intervening polymer matrix, wherein the a plurality of semiconductor nanoparticles each coordinated to a plurality of organic ligands. ## Claims ### Claim 1 An ink composition, comprising: a volatile solvent; and dispersed in the volatile solvent, a plurality of semiconductor nanoparticles each coordinated to a plurality of organic ligands, wherein a ratio by mass of the semiconductor nanoparticles to the volatile solvent is greater than 1:1. ### Claim 2 (depends on 1) The ink composition according to claim 1, wherein the volatile solvent includes a solvent which is a monocyclic terpenoid. ### Claim 3 (depends on 1) The ink composition according to claim 1, wherein the volatile solvent includes a solvent which is a monocyclic terpenoid and is an alcohol. ### Claim 4 (depends on 1) The ink composition according to claim 1, wherein the volatile solvent includes one or more of dihydroterpineol, terpineol, and dihydroterpineol acetate. ### Claim 5 (depends on 1) The ink composition according to claim 1, wherein the plurality of organic ligands includes an aliphatic thiol, carboxylic acid, or amine. ### Claim 6 (depends on 1) The ink composition according to claim 1, wherein the plurality of organic ligands includes dodecanethiol. ### Claim 7 (depends on 1) The ink composition according claim 1, wherein the ratio by mass of the semiconductor nanoparticles to the volatile solvent is between 2:1 and 4:1. ### Claim 8 (depends on 1) The ink composition according claim 1, wherein the ink composition substantially does not include a matrix material or other material other than the organic ligand surrounding the semiconductor nanoparticles. ### Claim 9 A product comprising: a solid substrate; and arranged on the solid substrate, a dried residue of an ink composition, the dried residue comprising a plurality of semiconductor nanoparticles arranged without an intervening polymer matrix, wherein the a plurality of semiconductor nanoparticles each coordinated to a plurality of organic ligands. ### Claim 10 (depends on 9) The product according to claim 9, wherein the plurality of semiconductor nanoparticles of the dried residue includes a close-packed layer of the semiconductor nanoparticles. ### Claim 11 (depends on 9) The product according to claim 9, wherein the dried residue consists substantially of the plurality of semiconductor nanoparticles. ### Claim 12 (depends on 11) The product according to claim 11, wherein the dried residue includes a trace amount of the volatile solvent. ### Claim 13 (depends on 9) The product according to claim 9, wherein the plurality of organic ligands includes an aliphatic thiol, carboxylic acid, or amine. ### Claim 14 (depends on 9) The product according to claim 9, wherein the plurality of organic ligands includes dodecanethiol. ### Claim 15 (depends on 9) The product according to claim 9, wherein the solid substrate comprises a substantially transparent substrate. ### Claim 16 A liquid resin composition comprising: a thermally polymerizable resin; and dispersed in the thermally polymerizable resin, a plurality of semiconductor nanoparticles each coordinated to a plurality of organic ligands, wherein a ratio by mass of the semiconductor nanoparticles to the thermally polymerizable resin is greater than 1:1. ### Claim 17 (depends on 16) The liquid resin composition according to claim 16, wherein the thermally polymerizable resin includes an acrylate monomer. ### Claim at position 18 -20. (canceled) ### Claim 21 (depends on 16) The liquid resin composition according claim 16, wherein the ratio by mass of the semiconductor nanoparticles to the thermally polymerizable resin is between 2:1 and 4:1. ### Claim at position 20 -28. (canceled) ### Claim 29 (depends on 9) The product according to claim 9, wherein the dried residue includes a trace amount of the volatile solvent.