# US 2023/0054699 A1 · Radiofrequency Signal Filter Arrangement for Plasma Processing System > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0054699 A1 - Document ID: US20230054699A1 - Status: Published application - Kind: A1 - Application number: 17/793,372 - Filed: 2021-01-30 - Published: 2023-02-23 - Earliest claimed: 2020-02-04 - Assignees: Lam Research Corporation - Applicants: Lam Research Corporation - Inventors: Alexei Marakhtanov; Felix Kozakevich; Bing Ji; Ranadeep Bhowmick; John Holland - Web page: https://patentgrep.com/patent/US20230054699A1 ## CPC - H01J 37/32183: {Matching circuits} - H01J 37/32715: {Workpiece holder} - H01J 37/32174: {Circuits specially adapted for controlling the RF discharge} - H01J 37/32541: {Shape} - H01J 37/32577: {Electrical connecting means} - H01J 37/32623: {Mechanical discharge control means} - H01J 37/32642: {Focus rings} - H01J 37/32724: {Temperature} - H01J 2237/3341: Reactive etching - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract A tunable edge sheath (TES) system includes a coupling ring configured to couple to a bottom surface of an edge ring that surrounds a wafer support area within a plasma processing chamber. The TES system includes an annular-shaped electrode embedded within the coupling ring. The TES system includes a plurality of radiofrequency signal supply pins coupled to the electrode within the coupling ring. Each of the plurality of radiofrequency signal supply pins extends through a corresponding hole formed through a bottom surface of the coupling ring. The TES system includes a plurality of radiofrequency signal filters respectively connected to the plurality of radiofrequency supply pins. Each of the plurality of radiofrequency signal filters is configured to provide a high impedance to radiofrequency signals used to generate a plasma within the plasma processing chamber. ## Claims ### Claim 1 A tunable edge sheath system, comprising: a coupling ring configured to couple to a bottom surface of an edge ring that surrounds a wafer support area within a plasma processing chamber; an electrode embedded within the coupling ring, the electrode having an annular shape; a plurality of radiofrequency signal supply pins coupled to the electrode embedded within the coupling ring, each of the plurality of radiofrequency signal supply pins extending through a corresponding hole formed through a bottom surface of the coupling ring; and a plurality of radiofrequency signal filters respectively connected to the plurality of radiofrequency supply pins, each of the plurality of radiofrequency signal filters configured to provide a high impedance to corresponding radiofrequency signals used to generate a plasma within the plasma processing chamber. ### Claim 2 (depends on 1) The tunable edge sheath system as recited in claim 1, wherein the corresponding radiofrequency signals used to generate the plasma within the plasma processing chamber have one or more frequencies within a range extending from about 1 megaHertz to about 100 megaHertz. ### Claim 3 (depends on 1) The tunable edge sheath system as recited in claim 1, wherein each of the plurality of radiofrequency supply pins is exclusively connected to a corresponding one of the plurality of radiofrequency signal filters. ### Claim 4 (depends on 1) The tunable edge sheath system as recited in claim 1, further comprising: a radiofrequency signal generator electrically connected through an impedance matching system to supply radiofrequency signals through the plurality of radiofrequency signal filters and through the plurality of radiofrequency supply pins to the electrode embedded within the coupling ring. ### Claim 5 (depends on 1) The tunable edge sheath system as recited in claim 1, further comprising: a radiofrequency signal supply conductor, each of the plurality of radiofrequency signal filters electrically connected to the radiofrequency signal supply conductor. ### Claim 6 (depends on 5) The tunable edge sheath system as recited in claim 5, wherein connection locations of the plurality of radiofrequency signal filters to the radiofrequency signal supply conductor are substantially equally spaced apart around the radiofrequency signal supply conductor. ### Claim 7 (depends on 5) The tunable edge sheath system as recited in claim 5, wherein the plurality of radiofrequency signal filters and the radiofrequency signal supply conductor are disposed within an atmospheric environment isolated from the plasma within the plasma processing chamber. ### Claim 8 (depends on 5) The tunable edge sheath system as recited in claim 5, further comprising: a radiofrequency signal supply line electrically connected between a radiofrequency signal output of the impedance matching system and the radiofrequency signal supply conductor. ### Claim 9 (depends on 8) The tunable edge sheath system as recited in claim 8, further comprising: a capacitor having a first terminal electrically connected to both the radiofrequency signal supply conductor and the radiofrequency signal supply line, the capacitor having a second terminal electrically connected to a reference ground potential. ### Claim at position 10 10-12. (canceled) ### Claim 13 (depends on 1) The tunable edge sheath system as recited in claim 1, wherein connection locations of the plurality of radiofrequency signal supply pins to the electrode within the coupling ring are substantially equally spaced apart around the electrode within the coupling ring. ### Claim 14 (depends on 1) The tunable edge sheath system as recited in claim 1, wherein a number of the plurality of radiofrequency signal supply pins is three, and wherein a number of the plurality of radiofrequency signal filters is three. ### Claim 15 A plasma processing system, comprising: a primary electrode having a substantially cylindrical shape defined by a top surface, a bottom surface, and an outer side surface; a ceramic layer disposed on the top surface of the primary electrode, the ceramic layer configured to receive and support a semiconductor wafer; a radiofrequency signal generator electrically connected through an impedance matching system to the primary electrode, the radiofrequency signal generator configured to generate and supply radiofrequency signals to the primary electrode; an edge ring formed of an electrically conductive material and configured to circumscribe the ceramic layer, the edge ring positioned radially adjacent to the ceramic layer; a coupling ring coupled to a bottom surface of the edge ring, the coupling ring formed of an electrical insulator material, the coupling ring including an embedded electrode; a plurality of radiofrequency signal supply pins electrically and physically connected to the embedded electrode, each of the plurality of radiofrequency signal supply pins extending through a corresponding hole formed through a bottom surface of the coupling ring; and a plurality of radiofrequency signal filters respectively connected to the plurality of radiofrequency supply pins, each of the plurality of radiofrequency signal filters configured to provide a high impedance to the radiofrequency signals that are supplied to the primary electrode by the radiofrequency signal generator. ### Claim 16 (depends on 15) The plasma processing system as recited in claim 15, wherein each of the plurality of radiofrequency supply pins is exclusively connected to a corresponding one of the plurality of radiofrequency signal filters. ### Claim 17 (depends on 15) The plasma processing system as recited in claim 15, wherein said radiofrequency signal generator is a first radiofrequency signal generator, and wherein said impedance matching system is a first impedance matching system, the plasma processing system including a second radiofrequency signal generator electrically connected through a second impedance matching system to supply radiofrequency signals through the plurality of radiofrequency signal filters and through the plurality of radiofrequency supply pins to the embedded electrode. ### Claim 18 (depends on 17) The plasma processing system as recited in claim 17, further comprising: a radiofrequency signal supply conductor, each of the plurality of radiofrequency signal filters electrically connected to the radiofrequency signal supply conductor. ### Claim 19 (depends on 18) The plasma processing system as recited in claim 18, wherein connection locations of the plurality of radiofrequency signal filters to the radiofrequency signal supply conductor are substantially equally spaced apart around the radiofrequency signal supply conductor. ### Claim 20 (depends on 18) The plasma processing system as recited in claim 18, wherein the plurality of radiofrequency signal filters and the radiofrequency signal supply conductor are disposed within an atmospheric environment isolated from a plasma processing region overlying the ceramic layer. ### Claim 21 (depends on 18) The plasma processing system as recited in claim 18, further comprising: a radiofrequency signal supply line electrically connected between a radiofrequency signal output of the second impedance matching system and the radiofrequency signal supply conductor. ### Claim 22 (depends on 21) The plasma processing system as recited in claim 21, further comprising: a capacitor having a first terminal electrically connected to both the radiofrequency signal supply conductor and the radiofrequency signal supply line, the capacitor having a second terminal electrically connected to a reference ground potential. ### Claim at position 21 23-25. (canceled) ### Claim 26 (depends on 15) The plasma processing system as recited in claim 15, wherein the embedded electrode has a substantially annular shape, wherein connection locations of the plurality of radiofrequency signal supply pins to the embedded electrode are substantially equally spaced apart around the embedded electrode. ### Claim 27 (canceled)