# US 2023/0054636 A1 · Surface acoustic wave (saw) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0054636 A1 - Document ID: US20230054636A1 - Status: Published application - Kind: A1 - Application number: 17/409,282 - Filed: 2021-08-23 - Published: 2023-02-23 - Earliest claimed: 2021-08-23 - Assignees: QUALCOMM Incorporated - Applicants: QUALCOMM Incorporated - Inventors: Ranadeep Dutta; Jonghae Kim; Je-Hsiung Lan - Web page: https://patentgrep.com/patent/US20230054636A1 ## CPC - H03H 9/1092: {the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's} - H03H 9/6406: {Filters characterised by a particular frequency characteristic} - H03H 3/10: for obtaining desired frequency or temperature coefficient - H03H 9/02834: {of temperature influence (cut angles H03H9/02543)} - H03H 9/059: {consisting of mounting pads or bumps} - H03H 9/1071: {the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) ## Abstract Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods are disclosed. The SAW filter package also includes a cavity frame comprising a perimeter structure and a cavity inside the perimeter structure coupled to a substrate of a piezoelectric material that contains interdigital transducers (IDTs). A cap substrate is disposed on the perimeter structure of the cavity frame to enclose an air cavity inside the perimeter structure between a substrate and the cap substrate. In exemplary aspects, to effectively dissipate heat generated in the SAW filter package to maintain the desired performance of the SAW filter, the cavity frame is comprised of a material that has an enhanced thermal conductivity. The heat generated in the SAW filter package can more effectively be dissipated, particularly at edges and corners of the cavity frame where hot spots can particularly occur. ## Claims ### Claim 1 A surface acoustic wave (SAW) filter package, comprising: a substrate comprising a piezoelectric material and having a first surface; a cap substrate; and a diamond cavity frame disposed between the substrate and the cap substrate that forms a cavity between the cap substrate and the first surface of the substrate; a first interdigital transducer (IDT) on the first surface of the substrate inside the cavity; and a second 1DT on the first surface of the substrate inside the cavity. ### Claim 2 (depends on 1) The SAW filter package of claim 1, wherein the cap substrate comprises at least one cap substrate side wall that is co-planar in a vertical direction with at least one frame side wall of the diamond cavity frame. ### Claim 3 (depends on 1) The SAW filter package of claim 1, wherein: the cap substrate comprises a first cap substrate side wall that extends along a first longitudinal axis and a second cap substrate side wall that extends along a second longitudinal axis parallel to the first longitudinal axis; the diamond cavity frame comprises a first frame side wall that extends along the first longitudinal axis and a second frame side wall that extends along the second longitudinal axis; and the first cap substrate side wall is co-planar to the first frame side wall in a vertical direction, and the second cap substrate side wall is co-planar to the second frame side wall in the vertical direction. ### Claim 4 (depends on 1) The SAW filter package of claim 1, wherein: the cap substrate comprises a rectangular-shaped cap substrate frame perimeter structure; the diamond cavity frame comprises a rectangular-shaped diamond frame perimeter structure; and the rectangular-shaped cap substrate frame perimeter structure is co-planar to the rectangular-shaped diamond frame perimeter structure. ### Claim 5 (depends on 1) The SAW filter package of claim 1, wherein the diamond cavity frame has a thermal conductivity between and including 600 and 2,000 Watts (W) per meter (m)-Kelvin (W/m-K). ### Claim 6 (depends on 1) The SAW filter package of claim 1, wherein the diamond cavity frame has a coefficient of thermal expansion (CTE) equal to one (1) part per million (ppm) per degree Celsius (C) (ppm/deg C.) or less. ### Claim 7 (depends on 1) The SAW filter package of claim 1, wherein the diamond cavity frame has an electrical resistivity between and including 1×1014 and 1×1018 Ohms centimeter (cm) (Ohms cm). ### Claim 8 (depends on 2) The SAW filter package of claim 2, further comprising: a first metal interconnect coupled to a first surface of the cap substrate opposite a second surface of the cap substrate; a second metal interconnect coupled to the first surface of the cap substrate; a first metal conductor disposed on a first cap substrate side wall among the at least one cap substrate side wall and a first frame side wall among the at least one frame side wall and coupling the first metal interconnect to the first IDT; and a second metal conductor disposed on a second cap substrate side wall among the at least one cap substrate side wall and a second frame side wall among the at least one frame side wall and coupling the second metal interconnect to the second IDT. ### Claim 9 (depends on 1) The SAW filter package of claim 1, further comprising: an Aluminum pad disposed on the first surface of the substrate; and wherein: the diamond cavity frame is coupled to the Aluminum pad to couple the diamond cavity frame to the substrate. ### Claim 10 (depends on 1) The SAW filter package of claim 1, wherein the cap substrate comprises a Silicon material. ### Claim 11 (depends on 1) The SAW filter package of claim 1, wherein: the diamond cavity frame comprises a diamond frame perimeter structure comprising a first perimeter surface coupled to the first surface of the substrate and a second perimeter surface; and the cap substrate comprises a second surface coupled to the second perimeter surface of the diamond frame perimeter structure and enclosing the cavity inside the diamond frame perimeter structure between the substrate and the cap substrate. ### Claim 12 (depends on 1) The SAW filter package of claim 1 integrated into a device selected from the group consisting of: a set top box; an entertainment unit; a navigation device; a communications device; a fixed location data unit; a mobile location data unit; a global positioning system (GPS) device; a mobile phone; a cellular phone; a smart phone; a session initiation protocol (SIP) phone; a tablet; a phablet; a server; a computer; a portable computer; a mobile computing device; a wearable computing device; a desktop computer; a personal digital assistant (PDA); a monitor; a computer monitor; a television; a tuner; a radio; a satellite radio; a music player; a digital music player; a portable music player; a digital video player; a video player; a digital video disc (DVD) player; a portable digital video player; an automobile; a vehicle component; avionics systems; a drone; and a multicopter. ### Claim 13 A surface acoustic wave (SAW) filter package, comprising: a substrate comprising a piezoelectric material and having a first surface; a cap substrate; a cavity frame having a thermal conductivity of at least five (5) Watts (W) per meter (m)-Kelvin (W/m-K), the cavity frame disposed between the substrate and the cap substrate that forms a cavity between the cap substrate and the first surface of the substrate; a first interdigital transducer (IDT) on the first surface of the substrate inside the cavity; and a second IDT on the first surface of the substrate inside the cavity. ### Claim 14 (depends on 13) The SAW filter package of claim 13, wherein the cap substrate comprises at least one cap substrate side wall that is co-planar in a vertical direction with at least one frame side wall of the cavity frame. ### Claim 15 (depends on 13) The SAW filter package of claim 13, wherein: the cap substrate comprises a first cap substrate side wall that extends along a first longitudinal axis and a second cap substrate side wall that extends along a second longitudinal axis parallel to the first longitudinal axis; the cavity frame comprises a first frame side wall that extends along the first longitudinal axis and a second frame side wall that extends along the second longitudinal axis; and the first cap substrate side wall is co-planar to the first frame side wall in a vertical direction, and the second cap substrate side wall is co-planar to the second frame side wall in the vertical direction. ### Claim 16 (depends on 13) The SAW filter package of claim 13, wherein: the cap substrate comprises a rectangular-shaped cap substrate frame perimeter structure; the cavity frame comprises a rectangular-shaped frame perimeter structure; and the rectangular-shaped cap substrate frame perimeter structure is co-planar to the rectangular-shaped frame perimeter structure. ### Claim 17 (depends on 13) The SAW filter package of claim 13, wherein the cavity frame has a coefficient of thermal expansion (CTE) less than or equal to ten (10) parts per million (ppm) per degree Celsius (C) (ppm/deg C.). ### Claim 18 (depends on 13) The SAW filter package of claim 13, wherein the cavity frame has an electrical resistivity greater than or equal to 1×1010 Ohms centimeter (cm) (Ohms cm). ### Claim 19 (depends on 13) The SAW filter package of claim 13, wherein the cavity frame comprises a material comprised from the group consisting of aluminum oxide, silicon nitride, and sapphire. ### Claim 20 (depends on 14) The SAW filter package of claim 14, further comprising: a first metal interconnect coupled to a first surface of the cap substrate opposite a second surface of the cap substrate; a second metal interconnect coupled to the first surface of the cap substrate; a first metal conductor disposed on a first cap substrate side wall among the at least one cap substrate side wall and a first frame side wall among the at least one frame side wall and coupling the first metal interconnect to the first IDT; and a second metal conductor disposed on a second cap substrate side wall among the at least one cap substrate side wall and a second frame side wall among the at least one frame side wall and coupling the second metal interconnect to the second IDT. ### Claim 21 (depends on 13) The SAW filter package of claim 13, further comprising: an Aluminum pad disposed on the first surface of the substrate; and wherein: the cavity frame is coupled to the Aluminum pad to couple the cavity frame to the substrate. ### Claim 22 (depends on 13) The SAW filter package of claim 13, wherein the cap substrate comprises a Silicon material. ### Claim 23 (depends on 13) The SAW filter package of claim 13 integrated into a device selected from the group consisting of: a set top box; an entertainment unit; a navigation device; a communications device; a fixed location data unit; a mobile location data unit; a global positioning system (GPS) device; a mobile phone; a cellular phone; a smart phone; a session initiation protocol (SIP) phone; a tablet; a phablet; a server; a computer; a portable computer; a mobile computing device; a wearable computing device; a desktop computer; a personal digital assistant (PDA); a monitor; a computer monitor; a television; a tuner; a radio; a satellite radio; a music player; a digital music player; a portable music player; a digital video player; a video player; a digital video disc (DVD) player; a portable digital video player; an automobile; a vehicle component; avionics systems; a drone; and a multicopter. ### Claim 24 A method of fabricating a surface acoustic wave (SAW) filter package, comprising: providing a cap substrate comprising a first surface; coupling a first surface of a cavity frame to the cap substrate, the cavity frame having a thermal conductivity of at least five (5) Watts (W) per meter (m)-Kelvin (W/m-K); providing a substrate comprising a piezoelectric material, a first surface, a first interdigital transducer (IDT) on the first surface of the substrate, and a second IDT on the first surface of the substrate; and coupling a second surface of the cavity frame to the first surface of the substrate thereby forming a cavity between the cap substrate and the first surface of the substrate and enclosing the first IDT and the second IDT. ### Claim 25 (depends on 24) The method of claim 24, comprising coupling the first surface of the cavity frame to the first surface of the cap substrate before coupling the second surface of the cavity frame to the first surface of the substrate. ### Claim 26 (depends on 24) The method of claim 24, further comprising forming the cavity frame, comprising: disposing an etch material layer comprising an etch material on the first surface of the cap substrate; patterning the etch material layer to form a perimeter opening in the etch material; disposing a cavity frame material of the cavity frame on the etch material and in the perimeter opening in the etch material; and removing the etch material layer. ### Claim 27 (depends on 26) The method of claim 26, further comprising grinding the cavity frame material to form the second surface of the cavity frame. ### Claim 28 (depends on 26) The method of claim 26, further comprising dicing the cavity frame coupled to the cap substrate in a vertical direction to form one or more cap substrate side walls of the cap substrate co-planar to one or more frame side walls of the cavity frame. ### Claim 29 (depends on 26) The method of claim 26, further comprising forming a first metal interconnect on the first surface of the substrate; and wherein: coupling the second surface of the cavity frame to the first surface of the substrate comprises coupling the second surface of the cavity frame to the first metal interconnect on the first surface of the substrate. ### Claim 30 (depends on 29) The method of claim 29, further comprising: forming a second metal interconnect on a second surface of the cap substrate opposite the first surface of the cap substrate; and disposing a metal conductor on a cap substrate side wall of the cap substrate and a frame side wall of the cavity frame coupling the first metal interconnect to the second metal interconnect. ### Claim 31 (depends on 24) The method of claim 24, wherein the cavity frame comprises a diamond cavity frame. ### Claim 32 (depends on 24) The method of claim 24, wherein the cavity frame has a coefficient of thermal expansion (CTE) less than or equal to ten (10) parts per million (ppm) per degree Celsius (C) (ppm/deg C.). ### Claim 33 (depends on 24) The method of claim 24, wherein the cavity frame has an electrical resistivity greater than or equal to 1×1010 Ohms centimeter (cm) (Ohms cm).