# US 2023/0054092 A1 · Sensor module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0054092 A1 - Document ID: US20230054092A1 - Status: Published application - Kind: A1 - Application number: 17/797,345 - Filed: 2021-02-05 - Published: 2023-02-23 - Earliest claimed: 2020-02-10 - Assignees: Sony Semiconductor Solutions Corporation - Applicants: Sony Semiconductor Solutions Corporation - Inventors: YUTARO YAMASHITA - Web page: https://patentgrep.com/patent/US20230054092A1 ## CPC - H05K 3/328: by welding - G03B 17/12: with means for supporting objectives, supplementary lenses, filters, masks, or turrets - H04N 23/51: Housings - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract A sensor module includes a housing, a board unit, an external connector, and a joining member. The housing includes a first case, and a second case that is welded to the first case. The board unit includes a sensor element, and is arranged in the housing. The external connector is provided to the second case, and includes an elastically deformable terminal that is electrically connected to the board unit. The joining member is mounted on the board unit and welded to the housing. ## Claims ### Claim 1 A sensor module, comprising: a housing that includes a first case, and a second case that is welded to the first case; a board unit that includes a sensor element, and is arranged in the housing; an external connector that is provided to the second case, and includes an elastically deformable terminal that is electrically connected to the board unit; and a joining member that is mounted on the board unit and welded to the housing. ### Claim 2 (depends on 1) The sensor module according to claim 1, wherein the board unit includes a first board that includes a first surface that supports the sensor element, a second board that includes a second surface that supports the joining member, and a board connector that connects the first board and the second board. ### Claim 3 (depends on 2) The sensor module according to claim 2, wherein the second surface is a surface that faces the second case, and the joining member is welded to the second case. ### Claim 4 (depends on 3) The sensor module according to claim 3, wherein the first case and the joining member are made of a synthetic-resin material that has absorptive properties with respect to laser light of a specified wavelength, and the second case is made of a synthetic-resin material that has transmissive properties with respect to the laser light. ### Claim 5 (depends on 3) The sensor module according to claim 3, wherein the first case and the joining member are made of a synthetic-resin material that has transmissive properties with respect to laser light of a specified wavelength, and the second case is made of a synthetic-resin material that has absorptive properties with respect to the laser light. ### Claim 6 (depends on 2) The sensor module according to claim 2, wherein the second surface is a surface that faces the first board, and the joining member is welded to the first case. ### Claim 7 (depends on 6) The sensor module according to claim 6, wherein the first case is made of a synthetic-resin material that has transmissive properties with respect to laser light of a specified wavelength, and the second case and the joining member are made of a synthetic-resin material that has absorptive properties with respect to the laser light. ### Claim 8 (depends on 6) The sensor module according to claim 6, wherein the first case is made of a synthetic-resin material that has absorptive properties with respect to laser light of a specified wavelength, and the second case and the joining member are made of a synthetic-resin material that has transmissive properties with respect to the laser light. ### Claim 9 (depends on 2) The sensor module according to claim 2, wherein the second surface is a surface that faces the second case, and the joining member is welded to the first case. ### Claim 10 (depends on 9) The sensor module according to claim 9, wherein the first case is made of a synthetic-resin material that has absorptive properties with respect to laser light of a specified wavelength, and the second case and the joining member are made of a synthetic-resin material that has transmissive properties with respect to the laser light. ### Claim 11 (depends on 2) The sensor module according to claim 2, wherein the second surface is a surface that faces the first board, and the joining member is welded to the second case. ### Claim 12 (depends on 11) The sensor module according to claim 11, wherein the first case and the joining member are made of a synthetic-resin material that has transmissive properties with respect to laser light of a specified wavelength, and the second case is made of a synthetic-resin material that has absorptive properties with respect to the laser light. ### Claim 13 (depends on 2) The sensor module according to claim 2, wherein the sensor element is a solid-state imaging device, and the housing further includes a barrel member that includes a barrel and a joining portion, the barrel being fitted into the first case, the joining portion being joined to the first surface. ### Claim 14 (depends on 2) The sensor module according to claim 2, wherein the sensor element is a solid-state imaging device, and the first case includes a barrel, and a joining portion that is joined to the first surface. ### Claim 15 (depends on 2) The sensor module according to claim 2, wherein the joining member includes a plurality of block materials arranged in a peripheral region of the second surface. ### Claim 16 (depends on 2) The sensor module according to claim 2, wherein the joining member is an annular member that is arranged in a peripheral region of the second surface.