# US 2023/0053718 A1 · Sealed interface power module housing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0053718 A1 - Document ID: US20230053718A1 - Status: Published application - Kind: A1 - Application number: 17/405,653 - Filed: 2021-08-18 - Published: 2023-02-23 - Earliest claimed: 2021-08-18 - Assignees: Virginia Tech Intellectual Properties, Inc.; The University of Nottingham - Applicants: Virginia Tech Intellectual Properties, Inc.; University of Nottingham - Inventors: Christina DiMarino; Mark Cairnie; Dushan Boroyevich; Rolando Burgos; C. Mark Johnson - Web page: https://patentgrep.com/patent/US20230053718A1 ## CPC - H05K 7/1457: {Power distribution arrangements} - H10W 76/12: characterised by their shape - H05K 1/184: associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes - H05K 3/325: by abutting or pinching; Mechanical auxiliary parts therefor - H05K 5/0095: {hermetically-sealed} - H05K 7/14329: {specially adapted for the configuration of power bus bars} - H10W 70/658: {for devices provided for in groups H10D8/00 - H10D48/00} - H05K 1/0256: {Electrical insulation details, e.g. around high voltage areas} - H05K 1/181: associated with surface mounted components - H05K 2201/0311: Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact - H05K 2201/09909: Special local insulating pattern, e.g. as dam around component - H05K 2201/10727: Leadless chip carrier [LCC], e.g. chip-modules for cards - H10W 76/15: Containers comprising an insulating or insulated base - H10W 76/47: Solid or gel fillings - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A number of different sealed interfaces for power modules are described. In one example, a sealed interface includes a printed circuit board including a contact pad for power conduction to a bus bar of the printed circuit board, a semiconductor module including at least one power transistor, a terminal pin electrically coupled to the power module, and a housing for the power module. The housing includes an open terminal aperture that extends through the housing. The printed circuit board is seated upon the open terminal aperture, to close and seal the open terminal aperture, with the contact pad positioned within the open terminal aperture. The terminal pin contacts the contact pad of the printed circuit board within the open terminal aperture, and the open terminal aperture comprises a transitional feature to abate electric field intensity around an interface between the open terminal aperture and the printed circuit board. ## Claims ### Claim 1 A sealed interface for a power module, comprising: a printed circuit board comprising a contact pad for power conduction to a bus bar of the printed circuit board; a semiconductor module comprising at least one power transistor; a terminal pin electrically coupled to the power module; and a housing for the power module, the housing comprising an open terminal aperture that extends through the housing, wherein: the printed circuit board is seated upon the open terminal aperture, to close and seal the open terminal aperture, with the contact pad positioned within the open terminal aperture; the terminal pin contacts the contact pad of the printed circuit board within the open terminal aperture; and the open terminal aperture comprises a transitional feature to abate electric field intensity around an interface between the open terminal aperture and the printed circuit board. ### Claim 2 (depends on 1) The sealed interface for the power module according to claim 1, wherein the terminal pin comprises a spring for contact compression with the contact pad of the printed circuit board. ### Claim 3 (depends on 1) The sealed interface for the power module according to claim 1, further comprising: a plurality of terminal pins electrically coupled to the power module, wherein: the housing comprises a plurality of open terminal apertures that extend through the housing, with at least one of the plurality of terminal pins extending within each of the plurality of open terminal apertures. ### Claim 4 (depends on 3) The sealed interface for the power module according to claim 3, wherein: a voltage potential between two open terminal apertures among the plurality of open terminal apertures is at least 10,000 V; and a center-to-center spacing between two open terminal apertures among the plurality of open terminal apertures is about 6 mm. ### Claim 5 (depends on 1) The sealed interface for the power module according to claim 1, wherein: the open terminal aperture comprises a planar rim surface; and the planar rim surface is elevated from an exterior surface of the housing. ### Claim 6 (depends on 5) The sealed interface for the power module according to claim 5, wherein a planar surface of the printed circuit board is secured over and contacts the planar rim surface. ### Claim 7 (depends on 5) The sealed interface for the power module according to claim 5, wherein the transitional feature comprises at least one of a curved surface or an angled surface with respect to the planar rim surface. ### Claim 8 (depends on 1) The sealed interface for the power module according to claim 1, wherein the open terminal aperture comprises a planar rim surface, an inner wall surface, and an outer wall surface. ### Claim 9 (depends on 8) The sealed interface for the power module according to claim 8, wherein the inner wall surface comprises the transitional feature between an interior surface of the housing and the planar rim surface. ### Claim 10 (depends on 8) The sealed interface for the power module according to claim 8, wherein the outer wall surface comprises the transitional feature between an exterior surface of the housing and the planar rim surface. ### Claim 11 (depends on 8) The sealed interface for the power module according to claim 8, wherein: the inner wall surface comprises a first transitional feature between an interior surface of the housing and the planar rim surface; and the outer wall surface comprises a second transitional feature between an exterior surface of the housing and the planar rim surface. ### Claim 12 (depends on 11) The sealed interface for the power module according to claim 11, wherein: the first transitional feature comprises an angled surface with respect to the planar rim surface; and the second transitional feature comprises a curved surface with respect to the planar rim surface. ### Claim 13 (depends on 1) The sealed interface for the power module according to claim 1, wherein the printed circuit board comprises at least one internal metal layer electrically coupled with the contact pad and extending within the printed circuit board to dislocate electric field intensity away from the interface between the open terminal aperture and the printed circuit board. ### Claim 14 A power module, comprising: a semiconductor module comprising at least one power transistor; a terminal pin electrically coupled to the power module; and a housing for the power module, the housing comprising an open terminal aperture that extends through the housing, wherein: the terminal pin extends within the open terminal aperture; and the open terminal aperture comprises a transitional feature to abate electric field intensity around the open terminal aperture. ### Claim 15 (depends on 14) The power module according to claim 14, further comprising: a plurality of terminal pins electrically coupled to the power module, wherein: the housing comprises a plurality of open terminal apertures that extend through the housing, with at least one of the plurality of terminal pins extending within each of the plurality of open terminal apertures. ### Claim 16 (depends on 14) The power module according to claim 14, wherein: the open terminal aperture comprises a planar rim surface; and the planar rim surface is elevated from an exterior surface of the housing. ### Claim 17 (depends on 14) The power module according to claim 14, wherein the transitional feature comprises at least one of a curved surface or an angled surface with respect to the planar rim surface. ### Claim 18 (depends on 14) The power module according to claim 14, wherein the open terminal aperture comprises a planar rim surface, an inner wall surface, and an outer wall surface. ### Claim 19 (depends on 18) The power module according to claim 18, wherein the inner wall surface comprises the transitional feature between an interior surface of the housing and the planar rim surface. ### Claim 20 (depends on 18) The power module according to claim 18, wherein the outer wall surface comprises the transitional feature between an exterior surface of the housing and the planar rim surface.