# US 2023/0053694 A1 · Splicing display screen > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0053694 A1 - Document ID: US20230053694A1 - Status: Published application - Kind: A1 - Application number: 17/053,735 - Filed: 2020-09-08 - Published: 2023-02-23 - Earliest claimed: 2020-08-10 - Assignees: Tcl China Star Optoelectronics Technology Co., Ltd. - Applicants: Tcl China Star Optoelectronics Technology Co., Ltd. - Inventors: Changming Xiang - Web page: https://patentgrep.com/patent/US20230053694A1 ## CPC - H05K 1/112: {directly combined with via connections} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10128: Display - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A splicing display screen is provided. The splicing display screen includes a circuit board, a plurality of display panels, and a plurality of first metal lines. The circuit board includes a plurality of circuit areas, and each of the circuit areas includes one of mounting areas and one of electrical connection areas. A plurality of first metal parts are disposed in the electrical connection areas. The display panels are disposed on the circuit board and positioned in the mounting areas, and metal connection pads on the display panels are electrically connected to the first metal parts by the first metal lines. ## Claims ### Claim 1 A splicing display screen, comprising: a circuit board having a plurality of circuit areas, wherein each of the circuit areas comprises one of mounting areas and one of electrical connection areas, and a plurality of first metal parts are disposed in the electrical connection areas; a plurality of display panels disposed on the circuit board and positioned in the mounting areas, wherein each of the display panels comprises one of metal connection pads disposed on a display surface of each of the display panels; and a plurality of first metal lines, wherein the metal connection pads are electrically connected to the first metal parts by the first metal lines. ### Claim 2 (depends on 1) The splicing display screen according to claim 1, further comprising a plurality of adhesive parts disposed in the mounting areas of the circuit board and attached between the circuit board and the display panels. ### Claim 3 (depends on 1) The splicing display screen according to claim 1, wherein the circuit board further comprises a bonding area disposed on one side of the circuit board, and a plurality of second metal parts are disposed in the bonding area. ### Claim 4 (depends on 3) The splicing display screen according to claim 3, further comprising at least one chip on film bonded in the bonding area and electrically connected to the second metal parts. ### Claim 5 (depends on 1) The splicing display screen according to claim 1, further comprising a sealing layer covering the circuit board, the display panels, the first metal parts, and the first metal lines. ### Claim 6 (depends on 1) The splicing display screen according to claim 1, wherein a distance between two of the display panels adjacent to each other ranges from 7 μm to 50 μm. ### Claim 7 (depends on 1) The splicing display screen according to claim 1, wherein each of the display panels comprises a substrate and a plurality of light-emitting diodes disposed on the substrate. ### Claim 8 (depends on 2) The splicing display screen according to claim 2, wherein a thickness of the adhesive parts ranges from 100 μm to 200 μm. ### Claim 9 (depends on 1) The splicing display screen according to claim 1, wherein a thickness of the first metal parts ranges from 0.2 μm to 0.5 μm. ### Claim 10 (depends on 1) The splicing display screen according to claim 1, wherein a diameter of the first metal lines ranges from 1 μm to 49 μm. ### Claim 11 (depends on 3) The splicing display screen according to claim 3, further comprising a plurality of via holes penetrating through the circuit board and exposing the display panels, wherein the via holes are positioned in the mounting areas. ### Claim 12 (depends on 11) The splicing display screen according to claim 11, further comprising at least one chip on film disposed on one side of the circuit board away from the display panels. ### Claim 13 (depends on 12) The splicing display screen according to claim 12, further comprising a plurality of second metal lines disposed on the circuit board and in the via holes, wherein the second metal lines are electrically connected to the first metal parts and the at least one chip on film. ### Claim 14 (depends on 12) The splicing display screen according to claim 12, further comprising a plurality of through-holes penetrating through the circuit board, wherein the through-holes are positioned in the bonding area. ### Claim 15 (depends on 14) The splicing display screen according to claim 14, further comprising a plurality of second metal lines disposed on the circuit board and in the through-holes, wherein the second metal lines are electrically connected to the second metal parts and the at least one chip on film.