# US 2023/0053559 A1 · Lead frame and electronic component

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- Number: US 2023/0053559 A1
- Document ID: US20230053559A1
- Status: Published application
- Kind: A1
- Application number: 17/857,872
- Filed: 2022-07-05
- Published: 2023-02-23
- Earliest claimed: 2021-08-20
- Assignees: TDK Corporation
- Applicants: TDK Corporation
- Inventors: Kazuma YAMAWAKI; Shuhei MIYAZAKI
- Web page: https://patentgrep.com/patent/US20230053559A1

## CPC

- H10W 70/465: {Bumps or wires}
- H10W 70/041: {Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps}
- H10W 70/048: {Mechanical treatments, e.g. punching, cutting, deforming or cold welding}
- H10W 70/421: {Shapes or dispositions}
- H10W 70/457: {of metallic layers on leadframes}
- H10W 74/01: Manufacture or treatment
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A lead frame includes a die pad, a plurality of leads, a frame member, and at least one wire. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. Each of the specific leads is connected to the first connection bar. At least one of the specific leads is connected to the second connection bar via the at least one wire.

## Claims

### Claim 1

A lead frame for an electronic component, comprising
a die pad;
a plurality of leads;
a frame member configured to surround the die pad and the plurality of leads; and
at least one wire, wherein
the frame member includes a first connection bar extending in a first direction and a second connection bar extending in a second direction,
the plurality of leads include a plurality of specific leads arranged along the first connection bar,
the plurality of specific leads are each connected to the first connection bar, and
at least one of the specific leads is connected to the second connection bar via the at least one wire.

### Claim 2 (depends on 1)

The lead frame according to claim 1, wherein a part of the at least one wire is disposed in an area to be removed in a manufacturing process of the electronic component.

### Claim 3 (depends on 1)

The lead frame according to claim 1, wherein the at least one wire is directly connected to at least one of the specific leads.

### Claim 4 (depends on 1)

The lead frame according to claim 1, wherein the at least one wire is directly connected to the second connection bar.

### Claim 5 (depends on 4)

The lead frame according to claim 4, wherein the second connection bar is plated with Au, Ag, Cu, Ni, or Pd-PPF.

### Claim 6 (depends on 1)

The lead frame according to claim 1, further comprising at least one connecting lead connected to the second connection bar, wherein
at least one of the specific leads is connected to the at least one connecting lead via the at least one wire.

### Claim 7 (depends on 6)

The lead frame according to claim 6, wherein the at least one connecting lead is plated with Au, Ag, Cu, Ni, or Pd-PPF.

### Claim 8 (depends on 6)

The lead frame according to claim 6, wherein
the at least one wire includes a plurality of wires,
the at least one connecting lead includes one connecting lead, and
the plurality of specific leads are connected to the one connecting lead via the plurality of wires.

### Claim 9 (depends on 8)

The lead frame according to claim 8, wherein
the at least one connecting lead includes a wide portion,
the wide portion has a first dimension in the first direction and a second dimension in the second direction, and
the second dimension is greater than or equal to the first dimension.

### Claim 10 (depends on 8)

The lead frame according to claim 8, wherein
the at least one connecting lead includes a wide portion, and
when seen in a third direction orthogonal to the first and second directions, the wide portion has an n-gon shape where n is 4 or more, a circular shape, or an elliptical shape.

### Claim 11 (depends on 9)

The lead frame according to claim 9, wherein the at least one connecting lead further includes a connection portion that connects the wide portion and the second connection bar.

### Claim 12 (depends on 9)

The lead frame according to claim 9, wherein the wide portion is disposed in an area to be removed in a manufacturing process of the electronic component.

### Claim 13 (depends on 1)

An electronic component manufactured using the lead frame according to claim 1, the electronic component comprising:
a chip mounted on the die pad; and
an encapsulating resin that encapsulates the die pad, and the chip, wherein
each of the leads has an exposed surface that is not covered with the encapsulating resin.

### Claim 14 (depends on 13)

The electronic component according to claim 13, further comprising a plating layer configured to cover the exposed surface.