Polishing amount estimation device

Abstract

There is provided a polishing amount estimation device which can facilitate the setting of parameters of teaching trajectory or force control in a polishing operation. A polishing amount estimation device for estimating a polishing amount in a polishing operation which is performed by bringing a polishing tool mounted on a robot manipulator into contact with a target workpiece by force control includes a memory which stores a motion program, and a polishing amount estimation part configured to estimate the polishing amount based on at least one of a motion trajectory of the polishing tool, a movement speed of the polishing tool, and a pressing force of the polishing tool against the target workpiece, which are obtained based on the motion program.

Dependencies are inferred from the claim text.