Power Module with Press-Fit Contacts
AssigneeInfineon Technologies AG
InventorsIvan Nikitin, Peter Luniewski
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Abstract
A method of forming a semiconductor device includes providing a substrate that comprises a metal region, forming an encapsulant body of electrically insulating material on an upper surface of the metal region, forming an opening in the encapsulant body, and inserting a press-fit connector into the opening, wherein after inserting the press-fit connector into the opening, the press-fit connector is securely retained to the substrate and an interfacing end of the press-fit connector is electrically accessible.
Claims20
A method of forming a semiconductor device, the method comprising:
- providing a substrate that comprises a metal region;
- forming an encapsulant body of electrically insulating material on an upper surface of the metal region;
- forming an opening in the encapsulant body;
- and
- inserting a press-fit connector into the opening;
- wherein after inserting the press-fit connector into the opening, the press-fit connector is securely retained to the substrate and an interfacing end of the press-fit connector is electrically accessible.
A semiconductor device, comprising:
- a substrate that comprises a metal region;
- an encapsulant body of electrically insulating material on an upper surface of the metal region;
- an opening in the encapsulant body;
- and
- a press-fit connector arranged in the opening and securely retained to the substrate such that an interfacing end of the press-fit connector is electrically accessible.
The semiconductor device of claim 19, wherein the semiconductor device is a power semiconductor module that comprises a power converter circuit.
Dependencies are inferred from the claim text.