Sensor device
AssigneeSony Semiconductor Solutions Corporation
InventorsKenichi TAGUCHI, Takahiro WAKABAYASHI
Life of this patent
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Abstract
A sensor device according to the present disclosure includes: a Peltier element; a sensor element thermally connected to a cooling surface of the Peltier element; and a package substrate that is thermally connected to a heat dissipation surface of the Peltier element and accommodates the Peltier element and the sensor element. In addition, the package substrate has a heat dissipation member, made of a material having a higher thermal conductivity than a material of the package substrate, on at least a part of a surface facing the heat dissipation surface of the Peltier element.
Claims10
A sensor device comprising:
- a Peltier element;
- a sensor element thermally connected to a cooling surface of the Peltier element;
- and
- a package substrate that is thermally connected to a heat dissipation surface of the Peltier element and accommodates the Peltier element and the sensor element,
- wherein the package substrate has a heat dissipation member, made of a material having a higher thermal conductivity than a material of the package substrate, on at least a part of a surface facing the heat dissipation surface of the Peltier element.
A sensor device comprising:
- a Peltier element;
- a sensor element thermally connected to a cooling surface of the Peltier element;
- and
- a package substrate that is made of ceramic, is configured integrally with a heat dissipation substrate of the Peltier element, and accommodates the Peltier element and the sensor element.
A sensor device comprising:
- a Peltier element;
- a relay substrate that is configured integrally with a cooling substrate of the Peltier element and relays electrical connection;
- a sensor element arranged on the relay substrate;
- and
- a package substrate that is made of ceramic, is thermally connected to a heat dissipation surface of the Peltier element, and accommodates the Peltier element, the relay substrate, and the sensor element.
Dependencies are inferred from the claim text.