Cup lid and self-producing water cup

A cup lid, applied to a cup having a cup body, wherein the cup lid comprises:

• a housing, defining a housing space, an air inlet, an air outlet, and a water outlet;
• wherein the air inlet, the air outlet, and the water outlet communicated to an outside;
• the air inlet, the air outlet, and the water outlet communicated to the housing space;
• a condensing mechanism, received in the housing and communicated to the air inlet;
• wherein the condensing mechanism is configured for condensing air flowing from the air inlet into water, and the water flows out through the water outlet, the condensing mechanism comprises a cooling member and a semiconductor cooling sheet, the semiconductor cooling sheet comprises a cold end, the cooling member is in contact with the cold end;
• and
• a heat dissipation mechanism, received in the housing and communicated to the air outlet;
• wherein the heat dissipation mechanism is configured for dissipating heat generated by the condensing mechanism, the heat dissipation mechanism comprises a heat dissipation member, the heat dissipation member comprises a heat dissipation body and a heat dissipation fin arranged on the heat dissipation body, the heat dissipation body is in contact with the semiconductor cooling sheet, the semiconductor cooling sheet further comprises a hot end;
• the cooling member is above the water outlet, the heat dissipation member is arranged at the hot end, the cup lid further comprises a first bracket arranged on the housing:
• wherein the condensing mechanism and the heat dissipation mechanism are arranged on the first bracket the first bracket comprises a first mounting plate, a second mounting plate, and a water collection port defined on the second mounting plate;
• a plane in which the first mounting plate is located is parallel to a connection direction of the cup body and the cup lid;
• the second mounting plate is connected to the first mounting plate, and a plane in which the second mounting plate is located is perpendicular to the plane in which the first mounting plate is located:
• the cooling member is arranged on the first mountins plate.