Semiconductor package with temperature sensor
OwnerEnis Tuncerinventor
Life of this patent
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Abstract
A semiconductor package includes a first set of leads, a temperature sensor proximate the first set of leads, a second set of leads, a semiconductor die, a first electrical connection between the temperature sensor and the semiconductor die, a second electrical connection between the semiconductor die and the second set of leads, and mold compound at least partially covering the temperature sensor, the semiconductor die, the first set of leads and the second set of leads. The mold compound physically separates the semiconductor die from the temperature sensor and the first set of leads.
Claims21
A semiconductor package comprising:
- a first set of leads;
- a temperature sensor proximate the first set of leads;
- a second set of leads;
- a semiconductor die;
- a first electrical connection between the temperature sensor and the semiconductor die;
- a second electrical connection between the semiconductor die and the second set of leads;
- and
- mold compound at least partially covering the temperature sensor, the semiconductor die, the first set of leads and the second set of leads,
- wherein the mold compound physically separates the semiconductor die from the temperature sensor and the first set of leads.
A method of forming a semiconductor package comprising:
- mounting a temperature sensor to a first die pad proximate a first set of leads;
- mounting a semiconductor die to a second die pad;
- forming a first electrical connection between the temperature sensor and the semiconductor die;
- forming a second electrical connection between the semiconductor die and a second set of leads;
- and
- molding a dielectric mold compound to at least partially cover the temperature sensor, the semiconductor die, the first set of leads and the second set of leads such that the dielectric mold compound physically separates the semiconductor die from the temperature sensor and the first set of leads.
Dependencies are inferred from the claim text.