Solid-State Direct Cavity Combiner (DCC) Transmitter System For Providing Megawatts Of Power

A solid-state direct cavity combiner (DCC) transmitter system for providing megawatts of power, the system comprising:

• a resonant cavity including at least one high-power output transmission line;
• hundreds of high-power transistors each generating an amount of power input directly into the resonant cavity;
• a plurality of modules each including a plurality of high-power transistors, a transmission line and a coupling loop;
• and
• the plurality of modules is positioned at multiple different radii on an end-plate on the resonant cavity to maximize packing density of the high-power transistors, each transmission line and coupling loop extending into the resonant cavity to match an impedance of each said high-power transistor of each said module to an impedance of said resonant cavity to electromagnetically couple power into the resonant cavity to provide the megawatts of power to the high-power output transmission line.

A solid-state direct cavity combiner (DCC) transmitter system for providing megawatts of power, the system comprising:

• a resonant cavity including at least one high-power output transmission line;
• hundreds of high-power transistors each generating an amount of power input directly into the resonant cavity;
• a plurality of modules each including at least one pair of high-power transistors differentially driving a transmission line and a coupling loop;
• the plurality of modules positioned at multiple different radii on an end-plate on the resonant cavity to maximize packing density of the high-power transistors, and
• each transmission line and coupling loop extending into the resonant cavity to match an impedance of each said high-power transistor of each said module to an impedance of said resonant cavity to electromagnetically couple power into the resonant cavity to provide the megawatts of power to the high-power output transmission line.

A method for providing megawatts of power with a solid-state direct cavity combiner (DCC) transmitter, the method comprising:

• providing a resonant cavity including at least one high-power output transmission line;
• providing hundreds of high-power transistors each generating an amount of power input directly into the resonant cavity;
• providing a plurality of modules each including at least one pair of high-power transistors differentially driving a transmission line and a coupling loop;
• and
• extending each said transmission line and coupling loop into the resonant cavity to match an impedance of each said high-power transistor of each said module to an impedance of said resonant cavity to electromagnetically couple power into the resonant cavity to provide the megawatts of power to the high-power output transmission line.

A method for providing megawatts of power with a solid-state direct cavity combiner (DCC) transmitter, the method comprising:

• providing a resonant cavity including at least one high-power output transmission line;
• providing hundreds of high-power transistors each generating an amount of power input directly into the resonant cavity;
• providing a plurality of modules each including a plurality of high-power transistors, a transmission line and a coupling loop;
• and
• placing the plurality of modules at multiple different radii on an end-plate on the resonant cavity to maximize packing density of the high-power transistors, and
• extending each transmission line and coupling loop into the resonant cavity to match an impedance of each said high-power transistor of each said module to an impedance of said resonant cavity to electromagnetically couple power into the resonant cavity to provide the megawatts of power to the high-power output transmission line.

A method for providing megawatts of power with a solid-state direct cavity combiner (DCC) transmitter, the method comprising:

• providing a resonant cavity including at least one high-power output transmission line;
• providing hundreds of high-power transistors each generating an amount of power input directly into the resonant cavity;
• providing a plurality of modules each including at least one pair of high-power transistors differentially driving transmission line and a coupling loop;
• and
• placing the plurality of modules positioned at multiple different radii on an end-plate on the resonant cavity to maximize packing density of the high-power transistors, and
• extending each transmission line and coupling loop into the resonant cavity to match an impedance of each said high-power transistor of each said module to an impedance of said resonant cavity to electromagnetically couple power into the resonant cavity to provide the megawatts of power to the high-power output transmission line.