# US 2022/0414408 A1 · Chipless radio frequency identification devices ("rfid")

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- Number: US 2022/0414408 A1
- Document ID: US20220414408A1
- Status: Published application
- Kind: A1
- Application number: 17/801,225
- Filed: 2021-02-18
- Published: 2022-12-29
- Earliest claimed: 2020-02-20
- Assignees: Inkjet Engine Technology
- Applicants: Inkjet Engine Technology
- Inventors: Louis Gautier Le Boulch; Edmond Abergel
- Web page: https://patentgrep.com/patent/US20220414408A1

## CPC

- G06K 19/0672: {with resonating marks}
- H01Q 1/2225: {used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal}
- H05K 1/0225: {Single or multiple openings in a shielding, ground or power plane (H05K1/0227 takes precedence)}
- G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The present invention relates to a radio frequency identification (personalized) device (RFID) without chip, in particular to a RFID tag (personalized) without chip, also referred to as chipless RFID tag.

## Claims

### Claim 1

Chipless RFID tag comprising:
a dielectric substrate on which a pattern or patterns are mounted composed of a layer of conductive material, wherein the dielectric substrate has a relative permittivity measured at any frequency between 3 and 10 GHz of between 1 and 2 and a loss tangent value measured at any frequency between 3 and 10 GHz of less than 10−3.

### Claim 2 (depends on 1)

Chipless RFID tag according to claim 1 wherein the dielectric substrate has a relative permittivity between 1.001 and 1.25.

### Claim 3 (depends on 1)

Chipless RFID tag according to claim 1 wherein the loss tangent value is less than 2.10−4.

### Claim 4 (depends on 1)

Chipless RFID tag according to claim 1 wherein a bulk density of the dielectric substrate is less than 250 kg·m−3.

### Claim 5 (depends on 1)

Chipless RFID tag according to claim 1 wherein the dielectric substrate is composed of a dielectric substrate having a relative permittivity between 1.001 and 1.25 and/or a loss tangent value less than 2.10−4 and/or a bulk density less than 100 kg·m−3 on which a dielectric film is mounted, on which is placed the pattern or patterns composed of a layer of conductive material.

### Claim 6 (depends on 5)

Chipless RFID tag according to claim 5 wherein the dielectric film is characterised by one, two or more of the following characteristics:
a relative permittivity measured at any frequency between 3 and 10 GHz greater than that of a main dielectric substrate, and/or
a loss tangent value measured at any frequency between 3 and 10 GHz greater than that of the main dielectric substrate, and/or
a thickness at least ten times less than that of the main dielectric substrate, and/or
composed of plastic material.

### Claim 7 (depends on 1)

Chipless RFID tag according to claim 1 wherein an upper part of the dielectric substrate is in contact with the pattern or patterns composed of a layer of conductive material.

### Claim 8 (depends on 1)

Chipless RFID tag according to claim 1 wherein the thickness of the dielectric substrate is greater than 0.5 mm.

### Claim 9 (depends on 1)

Chipless RFID tag according to claim 1 wherein a thickness of the dielectric substrate is less than 3 mm.

### Claim 10 (depends on 1)

Chipless RFID tag according to claim 1 wherein the conductive layer constituting the pattern has a conductive material thickness greater than 200 nm and less than 20 microns.

### Claim 11 (depends on 1)

Chipless RFID tag according claim 1 wherein the conductive layer constituting the pattern has a conductive material thickness greater than 400 nm and less than 2 microns.

### Claim 12 (depends on 1)

Chipless RFID tag with ground plane according to claim 1 further comprising a layer of conductive material under the dielectric substrate.

### Claim 13 (depends on 12)

Chipless RFID tag according to claim 12 wherein the layer of conductive material under the dielectric substrate has a conductive material thickness greater than 200 nm and less than 20 microns.

### Claim 14 (depends on 12)

Chipless RFID tag according to claim 12 wherein the layer of conductive material under the dielectric substrate has a conductive material thickness greater than 400 nm and less than 2 microns.

### Claim 15 (depends on 1)

Chipless RFID tag according to claim 1 wherein the dielectric substrate is selected from the group consisting of dielectric substrates made from solid foam, foam board, corrugated cardboard, cellular cardboard and fabric.

### Claim 16 (depends on 1)

Chipless RFID tag according to claim 1 wherein the dielectric substrate is a solid polymer foam.

### Claim 17 (depends on 1)

Chipless RFID tag according to claim 1 wherein the dielectric substrate is a solid polymer foam having a bubble density of between 104 and 109 bubbles/cm3.

### Claim 18 (depends on 1)

Chipless RFID tag according to claim 1 wherein the dielectric substrate is a solid polymer foam having a bubble size the average diameter of which is between 20 microns and 200 microns.

### Claim 19 (depends on 1)

Chipless RFID tag according to claim 1 wherein a ratio between a total upper surface of the dielectric substrate and an upper surface of the dielectric substrate covered with the pattern(s) composed of a layer of conductive material, is greater than 2.

### Claim 20 (depends on 1)

Chipless RFID tag according to claim 1 with a ground plane being a layer of conductive material under the dielectric substrate wherein a ratio between a lower surface of the dielectric substrate covered with the layer of conductive material and a total lower surface of the dielectric substrate, is greater than 0.9.

### Claim 21 (depends on 1)

Chipless RFID tag according to claim 1 comprising:
an optional conductive layer,
on which an optional dielectric film is mounted,
on which the main dielectric substrate is mounted
on which an optional dielectric film is mounted,
on which the pattern or patterns composed of a layer of conductive material are placed.

### Claim 22 (depends on 21)

Chipless RFID tag according to claim 21 wherein:
the conductive layer has a thickness of between 200 nm and 20 microns,
on which a dielectric film is mounted a thickness of which is between 5 microns and 100 microns,
on which the main dielectric substrate is mounted a thickness of which is between 0.5 mm and 3 mm,
on which a dielectric film is mounted a thickness of which is between 5 microns and 100 microns,
on which the pattern or patterns composed of a layer of conductive material are placed a thickness of which is between 200 nm and 20 microns.

### Claim 23 (depends on 1)

A process of manufacturing the chipless RFID tag according to claim 1, comprising wrapping or welding at an extremity of the layers making up the tag so as to keep the layers in contact without gluing the layers.