Method for Designing PCB Pads, Device and Medium
AssigneeInspur Suzhou Intelligent Technology Co., Ltd.
InventorCaikun Yang
Life of this patent
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Abstract
A method for designing PCB pads: using a drill bit of a first size to drill through a PCB from a first side; using a drill bit of a second size to back-drill a second side of the PCB so as to form a pyramid-shaped through hole; setting the connection means of a second layer and third layer of an inner layer of the PCB that comprises the pyramid-shaped through hole to full connection; and disposing a pad of a third size on a first layer of the inner layer, and disposing a pad of a fourth size on the last layer of the inner layer, wherein the fourth size is bigger than the third size, the fourth size is bigger than the second size, the second size is bigger than the first size, and the third size is bigger than the first size.
Claims14
A method for designing PCB pads, comprising the following steps:
- using a drill bit with a first size to drill through a PCB from a first side;
- using a drill bit with a second size to back-drill a second side of the PCB so as to form a pyramid-shaped through hole;
- setting the connection means of a second layer and third layer of an inner layer of the PCB that comprises the pyramid-shaped through hole to full connection;
- and
- disposing a pad with a third size on a first layer of the inner layer, and disposing a pad with a fourth size on the last layer of the inner layer,
- wherein the fourth size is bigger than the third size, the fourth size is bigger than the second size, the second size is bigger than the first size, and the third size is bigger than the first size.
A computer device, comprising:
- at least one processor;
- and
- a memory, wherein the memory stores a computer instruction capable of running on the processor, and the instruction, when being executed by the processor, implements the following steps:
- using a drill bit with a first size to drill through a PCB from a first side;
- using a drill bit with a second size to back-drill a second side of the PCB so as to form a pyramid-shaped through hole;
- setting the connection means of a second layer and third layer of an inner layer of the PCB that comprises the pyramid-shaped through hole to full connection;
- and
- disposing a pad with a third size on a first layer of the inner layer, and disposing a pad with a fourth size on the last layer of the inner layer,
- wherein the fourth size is bigger than the third size, the fourth size is bigger than the second size, the second size is bigger than the first size, and the third size is bigger than the first size.
Dependencies are inferred from the claim text.