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US 2022/0367112 A1Published application
Preformed chip manufacturing apparatus, preformed chip, dust core manufacturing apparatus, dust core, preformed chip manufacturing method, and dust core manufacturing method
AssigneesYoshiki Hirai, Hirai-Hpm Co., Ltd.
InventorYoshiki HIRAI
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Abstract
A preformed chip manufacturing apparatus includes a magnetic fixing suspension device including a pair of magnets which are a first magnet and a second magnet between which a magnetic field is formed for enabling a soft magnetic powder to be suspended therein, and a pair of punches configured to pressure mold the soft magnetic powder suspended in the magnetic field.
Claims20
A preformed chip manufacturing apparatus comprising:
- a magnetic fixing suspension device comprising a pair of magnets between which a magnetic field is formed for enabling a soft magnetic powder to be suspended therein;
- and
- a pair of punches configured to pressure mold the soft magnetic powder suspended in the magnetic field.
A preformed chip manufacturing method, comprising
- a suspension step of enabling a soft magnetic powder to be suspended in a magnetic field formed between a pair of magnets;
- and
- a soft magnetic powder pressurizing step of pressure molding the soft magnetic powder suspended in the suspension step.
Dependencies are inferred from the claim text.