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US 2022/0365448 A1Published application
Pattern forming method, resist material, and pattern forming apparatus
AssigneeOji Holdings Corporation
InventorsKazuyo MORITA, Kimiko HATTORI
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Abstract
It is an object of the present invention to provide a method of forming a high-contrast fine pattern onto a resist film. The present invention relates to a pattern forming method, comprising; applying a resist material onto a substrate to form a resist film, introducing a metal into the resist film, exposing, and developing. In addition, the present invention also relates to a resist material and a pattern forming apparatus.
Claims12
A pattern forming method, comprising:
- applying a resist material onto a substrate to form a resist film,
- introducing a metal into the resist film,
- exposing, and
- developing,
- wherein the introducing a metal is established between the applying the resist material and the exposing.
2 more elements
Dependencies are inferred from the claim text.