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US 2022/0356381 A1Published application
Adhesive tape
AssigneeDenka Company Limited
InventorsAkiyoshi KIMURA, Yosuke TATE, Daisuke YOSHIMURA
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Abstract
An adhesive tape comprising a porous substrate having a basis weight of 60-150 g/m2, a thickness of 200 μm or more, and a void ratio of 35 vol % or more, a resin layer provided to at least one surface of the porous substrate, and an adhesive layer provided on the resin layer, wherein the resin layer is formed from a resin composition (I) including a tackifier resin.
Claims4
An adhesive tape comprising
- a porous substrate having a basis weight of 60-150 g/m2, a thickness of 200 μm or more, and a void ratio of 35 vol % or more,
- a resin layer provided to at least one surface of the porous substrate, and
- an adhesive layer provided on the resin layer,
- wherein the resin layer is formed from a resin composition (I) including a tackifier resin.
1 more element
Dependencies are inferred from the claim text.