Pad surface regeneration and metal recovery
AssigneeChempower Corporation
InventorsSudhanshu Misra, Babu Suryadevara
Life of this patent
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Abstract
A method comprises planarizing a substrate material with a functionalized chemical planarization pad. The functionalized chemical planarization pad includes a plurality of functional groups bonded to a material of the pad. The functional groups are configured to chemically react with the substrate material such that a portion of substrate material bonds to the functional groups. The pad is regenerated by applying a regeneration solution configured to break bonds between the functional groups and substrate material bonded to the functional groups to form removed material. The removed material is complexed in a dissolved complexing agent to form dissolved material in an effluent phase.
Claims20
A method for using a functionalized chemical planarization pad in planarization processes, the method comprising:
- planarizing a substrate material with the functionalized chemical planarization pad, the functionalized chemical planarization pad including a plurality of functional groups bonded to a material of the pad, the functional groups being configured to chemically react with the substrate material such that a portion of substrate material bonds to the functional groups;
- regenerating the pad by applying a regeneration solution configured to break bonds between the functional groups and substrate material bonded to the functional groups to form removed material;
- and
- complexing the removed material in a dissolved complexing agent to form dissolved material in an effluent phase.
A method for recovering metal species in a planarization process, the method comprising:
- receiving, from the planarization process, a liquid effluent phase comprising a removed metal substrate material complexed to a complexing agent;
- extracting the dissolved material into a liquid extraction phase;
- and
- recovering the removed metal substrate material from the liquid extraction phase.
A method for using a functionalized chemical planarization pad and recovery of metal species in planarization processes, the method comprising:
- planarizing a substrate material with the functionalized chemical planarization pad including a plurality of functional groups bonded to a material of the pad, the functional groups being configured to chemically react with the substrate material such that a portion of substrate material bonds to the functional groups;
- regenerating the pad by applying a regeneration solution configured to break bonds between the functional groups and substrate material bonded to the functional groups to form removed material;
- complexing the removed material in a dissolved complexing agent to form dissolved material in an effluent phase;
- and
- recovering the dissolved material from the effluent phase.
Dependencies are inferred from the claim text.