Sensor system with a microelectromechanical sensor element and method for producing a sensor system
AssigneeInfineon Technologies Dresden GmbH
InventorsDirk MEINHOLD, Steffen BIESELT, Claudia HENGST, Daniel KOEHLER, Erhard LANDGRAF, Sebastian PREGL
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Abstract
A sensor system with a first semiconductor die part and with a second semiconductor die part is proposed, wherein the first semiconductor die part has a microelectromechanical sensor element, wherein the second semiconductor die part covers the microelectromechanical sensor element, wherein the second semiconductor die part has a via for electrically contacting the microelectromechanical sensor element, in particular directly. A method for producing a sensor system is also proposed.
Claims20
A sensor system comprising:
- a first semiconductor die part, and
- a second semiconductor die part,
- wherein the first semiconductor die part includes a microelectromechanical sensor element,
- wherein the second semiconductor die part covers the microelectromechanical sensor element, and
- wherein the second semiconductor die part includes a via for electrically contacting the microelectromechanical sensor element.
A method for producing a sensor system,
- providing a first semiconductor wafer,
- wherein a microelectromechanical sensor element is structured in the first semiconductor wafer,
- providing a second semiconductor wafer,
- connecting the first semiconductor wafer and the second semiconducting wafer to cover the microelectromechanical sensor element;
- and
- etching a hole through the second semiconductor wafer from a side opposite a contact surface between the first semiconductor wafer and the second semiconductor wafer.
Dependencies are inferred from the claim text.