Gunn diode and method of manufacturing the same

Abstract

A Gunn diode is disclosed which comprises a first contact layer (110), a second contact layer (120), and an active layer (130) based on a gallium nitride (GaN) semiconductor material having a base surface (132) and a side surface (135) non-parallel thereto. Optionally, related materials such as aluminum indium gallium nitride (AlInGaN) materials may also be used as the active layer. The first contact layer (110) electrically contacts the side surface (135) to form a side contact (115). The second contact layer (120) forms an electrical contact for the base surface (132), so that a maximum of the electric field strength is formed when an electric voltage is applied between the first contact layer (110) and the second contact layer (120) at the side contact (115).

Dependencies are inferred from the claim text.