Electronic device housings with electroless plating layers
AssigneeHewlett-Packard Development Company, L.P.
InventorsQingyong Guo, Kuan-Ting Wu, Ya Cheng Chuang, Feng Gu
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Abstract
In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating layer may be one of an electroless tin plating layer and an electroless silver plating layer. Further, the electronic device housing may include an electrophoretic deposition layer formed on the electroless plating layer.
Claims15
An electronic device housing comprising:
- a substrate;
- a micro-arc oxidation layer formed on a surface of the substrate;
- an electroless plating layer formed on the micro-arc oxidation layer, wherein the electroless plating layer is one of an electroless tin plating layer and an electroless silver plating layer;
- and
- an electrophoretic deposition layer formed on the electroless plating layer.
An electronic device housing comprising:
- a substrate;
- a micro-arc oxidation layer formed on a surface of the substrate;
- a first electroless plating layer formed on the micro-arc oxidation layer;
- a second electroless plating layer formed on the first electroless plating layer, wherein the second electroless plating layer is different from the first electroless plating layer;
- and
- an electrophoretic deposition layer formed on the second electroless plating layer.
A method of making a casing for an electronic device, the method comprising:
- pre-treating a surface of a metal substrate;
- forming an oxide layer on the pre-treated surface of the metal substrate;
- forming an electroless plating layer on the oxide layer, wherein the electroless plating layer comprises at least two materials selected from a group consisting of nickel, tin, and silver;
- and
- forming an electrophoretic deposition layer on the electroless plating layer.
Dependencies are inferred from the claim text.