Reactive adhesive film with good heat-and-humidity resistance, in particular for bonding polyamide
AssigneeTesa SE
InventorsUwe SCHÜMANN, Séverine CROUZY, Björn ZEYSING, Claudia MOEHRKE, Marta LUNDING
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Abstract
Reactive adhesive film for bonding various materials, including plastic to metal, the adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one epoxide-functionalized (meth)acrylate or vinyl monomer and (c) a reagent selected from an initiator, in particular a free-radical initiator, or an activator. Further disclosed are reactive adhesive film systems comprising two reactive adhesive films. Methods for producing reactive adhesive films, and methods are also disclosed.
Claims20
A reactive adhesive film, comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer and (c) a reagent selected from an initiator, or an activator, wherein the at least one reactive monomer comprises an epoxide-functionalized acrylic ester or epoxide-functionalized methacrylic ester or an epoxide-functionalized vinyl compound.
Dependencies are inferred from the claim text.