Composition for Encapsulant Film and Encapsulant Film Comprising the Same
AssigneeLG Chem, Ltd.
InventorsJin Sam Gong, Eun Jung Lee, Young Woo Lee, Jung Ho Jun, Jin Kuk Lee, Sang Hyun Hong, Jong Gil Kim, Hye Ji Lee, Sang Wook Han
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Abstract
The present invention relates to a composition for an encapsulant film, including an ethylene/alpha-olefin copolymer having excellent volume resistance and light transmittance, and an encapsulant film using the same.
Claims13
A composition for an encapsulant film comprising an ethylene/alpha-olefin copolymer satisfying the following conditions (a) to (c):
- (a) a density is 0.85 to 0.89 g/cc;
- (b) a melting temperature (Tm) having a maximum peak in a curve obtained by differential scanning calorimetry (DSC) is 40 to 90° C.;
- and
- (c) the melting temperature (Tm) and an elution temperature (Te) having a maximum peak in a curve obtained by cross-fractionation chromatography (CFC) satisfy the following Equation 1:
- 35° C.<Tm−Te<65° C. [Equation 1]
The method according to claim 13, wherein a molar ratio of the transition metal compound represented by Formula 1 and the transition metal compound represented by Formula 2 is 1:0.5 to 1:8.
The method according to claim 13, wherein hydrogen is injected at 5 to 100 cc/min.
Dependencies are inferred from the claim text.