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US 2022/0325091 A1Published application
Thermosetting sheet and dicing die bonding film
AssigneeNitto Denko Corporation
InventorsRena Kojima, Tomoaki Ichikawa
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Abstract
A thermosetting sheet according to the present invention includes a thermosetting resin and a thermoplastic resin, in which a thickness change rate when a temperature is changed from 25° C. to 200° C. is 0% or more and 10% or less.
Claims6
A thermosetting sheet comprising a thermosetting resin and a thermoplastic resin, wherein
- a thickness change rate when a temperature is changed from 25° C. to 200° C. is 0% or more and 10% or less.
Dependencies are inferred from the claim text.