Sensor Element and Method for Producing a Sensor Element

A sensor element comprising:

• at least one carrier layer having a top side and an underside;
• and
• at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and comprises a material having a temperature-dependent electrical resistance,
• wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and
• wherein the sensor element is configured to measure a temperature.

A method for producing a sensor element, the method comprising:

• providing a carrier material for forming a carrier layer;
• forming at least one feedthrough, wherein the feedthrough completely penetrates through the carrier material;
• filling the at least one feedthrough with a metallic material;
• coating the carrier material with a sensor material for forming a functional layer;
• and
• singulating sensor elements.

A sensor element comprising:

• at least one carrier layer having a top side and an underside;
• at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and comprises a material having a temperature-dependent electrical resistance;
• and
• at least one protective layer arranged at a top side of the sensor element and at least one side surface of the sensor element, wherein the protective layer completely covers the top side of the sensor element,
• wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system,
• wherein the sensor element is configured for direct integration into a MEMS structure and/or into a semiconductor embedded in substrate (SESUB) structure, and
• wherein the sensor element is configured to measure a temperature.