# US 2022/0286104 A1 · Vibrator device, vibrator module, and electronic apparatus

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- Number: US 2022/0286104 A1
- Document ID: US20220286104A1
- Status: Published application
- Kind: A1
- Application number: 17/804,031
- Filed: 2022-05-25
- Published: 2022-09-08
- Earliest claimed: 2019-01-31
- Assignees: Seiko Epson Corporation
- Applicants: Seiko Epson Corporation
- Inventors: Junichi TAKEUCHI
- Web page: https://patentgrep.com/patent/US20220286104A1

## CPC

- H03H 9/02133: {of stress}
- H03H 3/02: for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence)
- H03H 9/0509: {consisting of adhesive elements}
- H03H 9/1021: {the BAW device being of the cantilever type}
- H03H 9/19: consisting of quartz
- H03H 2003/022: {the resonators or networks being of the cantilever type}
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)

## Abstract

A vibrator device includes a base, a vibrator element attached to the base, and a lid housing the vibrator element between the base and itself and bonded to the base. The base has a semiconductor substrate including a first surface bonded to the lid and a second surface in a front-back relationship with the first surface, a first insulating layer placed on the first surface, first, second internal terminals placed on the first insulating layer and electrically coupled to the vibrator element, a second insulating layer placed on the second surface, and first, second external terminals placed on the second insulating layer and electrically coupled to the first, second internal terminals. The second insulating layer has a first external terminal region in which the first external terminal is placed and a second external terminal region separated from the first external terminal region, in which the second external terminal is placed.

## Claims

### Claim 1

A vibrator device comprising:
a base having
a semiconductor substrate including a first surface and a second surface in a front-back relationship with the first surface,
a semiconductor circuit formed in the semiconductor substrate and having an active surface on the first surface side or the second surface side of the semiconductor substrate,
a first insulating layer placed on the first surface,
a first internal terminal and a second internal terminal placed on the first insulating layer,
a second insulating layer placed on the second surface and divided into a plurality of regions including a first external terminal region and a second external terminal region separated from the first external terminal region,
a first external terminal placed in the first external terminal region and electrically coupled to the first internal terminal, and
a second external terminal placed in the second external terminal region and electrically coupled to the second internal terminal;
a vibrator element placed on the first surface and electrically coupled to the first internal terminal and the second internal terminal; and
a lid bonded to the first surface and housing the vibrator element between the base and itself.

### Claim 2 (depends on 1)

The vibrator device according to claim 1, wherein
the base has an insulating layer non-formation region having no insulating layer, and
the first external terminal region and the second external terminal region are separated by the insulating layer non-formation region.

### Claim 3 (depends on 2)

The vibrator device according to claim 2, wherein
the semiconductor substrate has a rectangular shape in a plan view, and
the insulating layer non-formation region connects a pair of facing sides of the semiconductor substrate in the plan view.

### Claim 4 (depends on 2)

The vibrator device according to claim 2, wherein
the semiconductor substrate has a rectangular shape in a plan view, and
the insulating layer non-formation region connects one side of the semiconductor substrate and one of two sides adjacent to the side in the plan view.

### Claim 5 (depends on 1)

The vibrator device according to claim 1, wherein
the plurality of regions of the second insulating layer further includes:
a third external terminal region separated from the first external terminal region and the second external terminal region; and
a fourth external terminal region separated from the first external terminal region, the second external terminal region, and the third external terminal region, and
the base has a third external terminal placed in the third external terminal region and a fourth external terminal placed in the fourth external terminal region.

### Claim 6 (depends on 5)

The vibrator device according to claim 5, wherein
the base has an insulating layer non-formation region having no insulating layer, and
the first external terminal region, the second external terminal region, the third external terminal region,
and the fourth external terminal region are separated by the insulating layer non-formation region.

### Claim 7 (depends on 6)

The vibrator device according to claim 6, wherein
the semiconductor substrate has a rectangular shape in a plan view, and
the insulating layer non-formation region has a first portion connecting a first side contained in an outer edge of the semiconductor substrate and a second side facing the first side, and a second portion connecting a third side and a fourth side facing the third side in the plan view.

### Claim 8 (depends on 1)

The vibrator device according to claim 1, wherein
the first insulating layer has a first internal terminal region in which the first internal terminal is placed and a second internal terminal region separated from the first internal terminal region, in which the second internal terminal is placed,
an outer edge of the first internal terminal region is located outside of an outer edge of the first internal terminal along the outer edge of the first internal terminal in a plan view, and
an outer edge of the second internal terminal region is located outside of an outer edge of the second internal terminal along the outer edge of the second internal terminal in the plan view.

### Claim 9 (depends on 1)

The vibrator device according to claim 1, wherein
an outer edge of the first external terminal region is located outside of an outer edge of the first external terminal along the outer edge of the first external terminal in a plan view, and
an outer edge of the second external terminal region is located outside of an outer edge of the second external terminal along the outer edge of the second external terminal in the plan view.

### Claim 10

A vibrator device comprising:
a base having
a semiconductor substrate including a first surface and a second surface in a front-back relationship with the first surface,
a semiconductor circuit formed in the semiconductor substrate and having an active surface on the first surface side or the second surface side of the semiconductor substrate,
a first insulating layer placed on the first surface and divided into a plurality of regions including a first internal terminal region and a second internal terminal region separated from the first internal terminal region,
a first internal terminal placed in the first internal terminal region,
a second internal terminal placed in the second internal terminal region,
a second insulating layer placed on the second surface,
a first external terminal placed on the second insulating layer and electrically coupled to the first internal terminal, and
a second external terminal placed on the second insulating layer and electrically coupled to the second internal terminal;
a vibrator element placed on the first surface and electrically coupled to the first internal terminal and the second internal terminal; and
a lid bonded to the first surface and housing the vibrator element between the base and itself.

### Claim 11 (depends on 10)

The vibrator device according to claim 10, wherein
an outer edge of the first internal terminal region is located outside of an outer edge of the first internal terminal along the outer edge of the first internal terminal in a plan view, and
an outer edge of the second internal terminal region is located outside of an outer edge of the second internal terminal along the outer edge of the second internal terminal in the plan view.
