# US 2022/0285641 A1 · Method for electrically conductively contacting an optoelectronic component having at least one protective layer and optoelectronic component having a contacting of this type > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2022/0285641 A1 - Document ID: US20220285641A1 - Status: Published application - Kind: A1 - Application number: 17/636,368 - Filed: 2020-08-18 - Published: 2022-09-08 - Earliest claimed: 2019-08-19 - Assignees: Heliatek GmbH - Applicants: Heliatek GmbH - Inventors: Michael Eritt; Christian Kirchhof; Susanne Mueller; Ingrid Panicke; Christian Wisinger - Web page: https://patentgrep.com/patent/US20220285641A1 ## CPC - H10F 77/935: {for photovoltaic devices or modules} - H10F 77/939: {Output lead wires or elements} - H10K 30/80: Constructional details - H10K 30/81: Electrodes - H10K 30/88: Passivation; Containers; Encapsulations - H10K 77/111: {Flexible substrates} - Y02E 10/50: Photovoltaic [PV] energy - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract A method for electrically conductively contacting an optoelectronic component having at least one protective layer, including: providing the optoelectronic component having the at least one protective layer with at least one busbar arranged below the at least one protective layer, forming at least one opening by at least one laser beam in the at least one protective layer, wherein at least one busbar arranged below the at least one protective layer is partly exposed, such that the at least one busbar is not damaged, introducing a low-melting solder into the at least one opening of the at least one protective layer, aligning and fixing an electrically conductive element that is flexible on a side of the at least one opening opposite the at least one busbar, and forming an electrically conductive connection element in the at least one opening. ## Claims ### Claim 1 A method for electrically conductively contacting an optoelectronic component having at least one protective layer comprising: a) providing the optoelectronic component having the at least one protective layer, wherein the optoelectronic component has at least one busbar arranged below the at least one protective layer, b) forming at least one opening by laser ablation using at least one laser beam in the at least one protective layer, wherein the wavelength range of the laser is 8 μm to 12 μm, wherein at least one busbar arranged below the at least one protective layer is partly exposed, such that the at least one busbar is not damaged, c) introducing a low-melting solder into the at least one opening of the at least one protective layer, and aligning and fixing an electrically conductive element that is flexible on a side of the at least one opening opposite the at least one busbar, and d) forming, by inductive soldering with a uniform heat input, an electrically conductive connection element in the at least one opening, such that the electrically conductive element and the at least one busbar are electrically conductively contacted via the at least one connection element. ### Claim 2 (depends on 1) The method as claimed in claim 1, wherein after step d) the at least one electrically conductive element is electrically conductively connected to a junction box, wherein the junction box is arranged on the optoelectronic component on a region at a distance from a corner of the optoelectronic component. ### Claim 3 (depends on 1) The method as claimed in claim 1, wherein the laser medium of the at least one laser beam in step b) is CO2. ### Claim 4 (depends on 1) The method as claimed in claim 1, wherein in step c) a solder preform is introduced into the at least one opening. ### Claim 5 (depends on 1) The method as claimed in claim 1, wherein the at least one opening has a cross-sectional area of 0.1 to 75 mm2, wherein a contact area of the connection element with the at least one busbar and/or with the electrically conductive element is smaller than the area of the at least one busbar facing the connection element. ### Claim 6 (depends on 1) The method as claimed in claim 1, wherein the low-melting solder for forming the connection element is selected from the group consisting of bismuth, copper, silver, tin, and an alloy of at least one of these elements. ### Claim 7 (depends on 1) The method as claimed in claim 1, wherein at least one connection material is arranged between the at least one protective layer and the at least one busbar, and wherein in step b) the at least one opening is formed in the at least one protective layer and in the connection material arranged on the at least one protective layer. ### Claim 8 (depends on 1) The method as claimed in claim 1, wherein the electrically conductive element is a plate having a layer thickness of 10 μm to 100 μm. ### Claim 9 (depends on 1) The method as claimed in claim 1, wherein the at least one busbar is composed of at least one metal or an alloy thereof, and wherein the at least one busbar and the electrically conductive element comprise the same material. ### Claim 10 (depends on 1) The method as claimed in claim 1, further comprising performing a roll-to-roll process. ### Claim 11 (depends on 1) An optoelectronic component that is flexible, having at least one protective layer and having at least one busbar arranged below the at least one protective layer of the optoelectronic component, wherein the optoelectronic component has at least one electrically conductive contact produced according to claim 1, wherein the at least one electrically conductive contact electrically conductively contacts the at least one busbar to a flexible electrically conductive element by an electrically conductive connection element, and wherein the optoelectronic component is electrically conductively connected to a junction box. ### Claim 12 (depends on 11) The optoelectronic component as claimed in claim 11, wherein at least one connection material comprising an adhesive is arranged between the at least one protective layer and the at least one busbar. ### Claim 13 (depends on 11) The optoelectronic component as claimed in claim 11, wherein the optoelectronic component is a flexible solar cell having an electrode, a counterelectrode, and a layer system having at least one photoactive layer, wherein the layer system is arranged between the electrode and counterelectrode and wherein the at least one busbar is electrically conductively contacted at least partly at the electrode and/or the counterelectrode. ### Claim 14 (depends on 13) The optoelectronic component as claimed in claim 13, wherein a first busbar electrically conductively contacts the at least one electrode and a second busbar electrically conductively contacts the at least one counterelectrode, wherein the first busbar leads to a first electrically conductive element and the second busbar leads to a second electrically conductive element, and wherein the first and second electrically conductive elements are electrically conductively connected to the junction box. ### Claim 15 (depends on 11) The optoelectronic component as claimed in claim 11, wherein the junction box is arranged on a side of the optoelectronic component that faces the sun and the flexible electrically conductive element is arranged on a side of the optoelectronic component that faces away from the sun. ### Claim 16 (depends on 1) The method as claimed in claim 1, wherein the electrically conductive element is embodied as a strip, wherein the strip has a layer thickness of 10 μm to 100 μm or is embodied as a wire with a cross-sectional area of 0.1 mm2 to 2 mm2.