# US 2022/0285249 A1 · Bottom package exposed die mems pressure sensor integrated circuit package design

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- Number: US 2022/0285249 A1
- Document ID: US20220285249A1
- Status: Published application
- Kind: A1
- Application number: 17/752,567
- Filed: 2022-05-24
- Published: 2022-09-08
- Earliest claimed: 2016-07-15
- Assignees: STMicroelectronics S.r.l.
- Applicants: Stmicroelectronics, Inc.
- Inventors: Aaron CADAG; Frederick ARELLANO; Ernesto ANTILANO, JR.
- Web page: https://patentgrep.com/patent/US20220285249A1

## CPC

- H10W 70/421: {Shapes or dispositions}
- B81B 7/0058: {for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations}
- B81C 1/00825: {Protect against mechanical threats, e.g. against shocks, or residues (B81C1/00261 take precedence)}
- H10W 72/073: {of die-attach connectors}
- H10W 72/075: {of bond wires}
- H10W 72/30: Die-attach connectors
- H10W 72/50: Bond wires
- H10W 72/851: {Dispositions of multiple connectors or interconnections}
- H10W 74/016: {using moulds}
- H10W 74/017: {Auxiliary layers for moulds, e.g. release layers or layers preventing residue}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- B81B 2201/0264: Pressure sensors
- B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package
- B81B 2207/07: Interconnects
- B81B 2207/098: Arrangements not provided for in groups B81B2207/092 - B81B2207/097
- B81C 2203/01: Packaging MEMS
- B81C 2203/032: Gluing
- B81C 2203/0792: Forming interconnections between the electronic processing unit and the micromechanical structure
- H10W 72/354: {comprising polymers}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 72/5473: {multiple bond wires connected to a common bond pad}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 76/17: characterised by their materials
- H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/732: {between stacked chips}
- H10W 90/752: {between stacked chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)

## Abstract

A MEMS pressure sensor packaged with a molding compound. The MEMS pressure sensor features a lead frame, a MEMS semiconductor die, a second semiconductor die, multiple pluralities of bonding wires, and a molding compound. The MEMS semiconductor die has an internal chamber, a sensing component, and apertures. The MEMS semiconductor die and the apertures are exposed to an ambient atmosphere. A method is desired to form a MEMS pressure sensor package that reduces defects caused by mold flashing and die cracking. Fabrication of the MEMS pressure sensor package comprises placing a lead frame on a lead frame tape; placing a MEMS semiconductor die adjacent to the lead frame and on the lead frame tape with the apertures facing the tape and being sealed thereby; attaching a second semiconductor die to the MEMS semiconductor die; attaching pluralities of bonding wires to form electrical connections between the MEMS semiconductor die, the second semiconductor die, and the lead frame; and forming a molding compound.

## Claims

### Claim 1

A device, including:
a package having a first side and a second side that faces away from the first side, the package including:
a MEMS semiconductor on the first side of the package, the MEMS semiconductor die including:
a first surface exposed on the first side of the package;
an internal chamber;
a sensing component within the internal chamber; and
an aperture extending into the first surface of the MEMS semiconductor die, the aperture extending from the first surface of the MEMS semiconductor die to the internal chamber;
a lead frame on the second side of the package;
a molding compound partially covering the MEMS semiconductor die and the lead frame, the first surface of the MEMS semiconductor die being flush with the molding compound at the first side of the package; and
a plurality of bonding wires electrically coupling the lead frame to the MEMS semiconductor die.

### Claim 2 (depends on 1)

The device of claim 1, further comprising a second die coupled to the MEMS semiconductor die, wherein:
the MEMS semiconductor die includes:
a second surface opposite to the first surface, the second surface is coupled to the second die;
the second die includes:
a third surface adjacent to the second surface of the MEMS semiconductor die; and
a fourth surface facing away from the fourth surface of the second die.

### Claim 3 (depends on 2)

The device of claim 2, wherein the fourth surface of the second die is coupled to the second surface of the MEMS semiconductor die by a conductive adhesive that electrically couples the MEMS semiconductor die to the second die.

### Claim 4 (depends on 2)

The device of claim 2, wherein:
the leadframe includes a fifth surface covered by the molding compound; and
each respective bonding wire of the plurality of bonding wires includes a first end coupled to the fifth surface of the lead frame and a second end coupled to the third surface of the second semiconductor die.

### Claim 5

A device, comprising:
a package having a first side and a second side that faces away from the first side, the package including:
a MEMS semiconductor on the first side of the package, the MEMS semiconductor die including:
a first surface exposed at the first side of the package;
a second surface facing away from the first surface;
an internal chamber;
a sensing component within the internal chamber; and
an aperture extending into the first surface of the MEMS semiconductor die, the aperture extending from the first surface of the MEMS semiconductor die to the internal chamber;
a lead frame on the second side of the package, the lead frame having a third surface and a fourth surface facing away from the third surface, the third surface is exposed at the second side of the package;
a second die including a fifth surface and a sixth surface, the fifth surface coupled to the second surface of the MEMS semiconductor die by a conductive adhesive that electrically couples the second die to the MEMS semiconductor die;
a molding compound partially covering the MEMS semiconductor die and the lead frame, the first surface of the MEMS semiconductor die being flush with the molding compound at the first side of the package, the fourth surface of the lead frame being flush with the molding compound at the second side of the package; and
a plurality of electrical connectors coupling the third surface of the lead frame to the sixth surface of the second die, the plurality of electrical connectors electrically coupling the lead frame to the second die.

### Claim 6 (depends on 5)

The device of claim 5, wherein the second die includes first contact pads on the fifth surface of the second die and second contact pads on the sixth surface of the second die, the first contact pads coupled to the second contact pads through electrical vias.

### Claim 7 (depends on 5)

The device of claim 5, wherein the lead frame includes a plurality of leads and an open region between the respective leads of the plurality of leads.

### Claim 8 (depends on 7)

The device of claim 7, wherein the second die extends to each respective lead of the plurality of leads and is electrically coupled to each lead of the plurality of leads through the plurality of electrical connectors.

### Claim 9 (depends on 7)

The device of claim 7, wherein each respective electrical connector is at least one of a solder ball or a metal pillar connector.

### Claim 10 (depends on 5)

The device of claim 5, wherein the sensing component is a pressure sensor.

### Claim 11 (depends on 5)

The device of claim 5, wherein the aperture exposes the internal chamber and the sensing component to an external environment.

### Claim 12

A device, comprising:
a molding compound having a first side a second side opposite to the first side;
a MEMS semiconductor in the molding compound, the MEMS semiconductor including:
a first surface exposed from the first side of the molding compound;
a second surface opposite to the first surface and facing away from the first surface;
an internal chamber;
a sensing component within the internal chamber; and
an aperture extending into the first surface to the internal chamber;
a lead frame in the molding compound and at the second side of the package, the lead frame having a third surface exposed from the molding compound and a fourth surface opposite to the third surface;
a second die in the molding compound, the second die including a fifth surface exposed from the molding compound and a sixth surface opposite to the fifth surface, the fifth surface of the second die is coupled to the second surface of the MEMS semiconductor; and
a plurality of electrical connection structures are coupled to the second die and the lead frame.

### Claim 13 (depends on 12)

The device of claim 12, wherein the aperture includes an opening at the first surface of the MEMS semiconductor, and the first surface and the opening are flush with the first side of the molding compound.

### Claim 14 (depends on 12)

The device of claim 12, wherein the plurality of electrical connection structures are a plurality of wires.

### Claim 15 (depends on 14)

The device of claim 14, wherein the plurality of wires have first ends coupled to the fourth surface of the lead frame, and second ends coupled to the fifth surface of the second die.

### Claim 16 (depends on 12)

The device of claim 12, wherein the plurality of electrical connection structures are a plurality of conductive pillar connectors.

### Claim 17 (depends on 16)

The device of claim 16, wherein the plurality of conductive pillar connectors extend from the fourth surface of the lead frame to the sixth surface of the second die.

### Claim 18 (depends on 17)

The device of claim 17, wherein the second die extends from a first portion of the lead frame at a first sidewall of the molding compound to a second portion of the lead frame at a second sidewall of the molding compound, and the first and second sidewalls are transverse to the first and second sides and the first and second sidewalls extend from the first side to the second side.

### Claim 19 (depends on 18)

The device of claim 18, wherein the first and second portions are first and second leads of the lead frame.

### Claim 20 (depends on 12)

The device of claim 12, wherein the second die is an application-specific integrated circuit (ASIC) die.