# US 2022/0285201 A1 · Wafer assembly for mems fabrication

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- Number: US 2022/0285201 A1
- Document ID: US20220285201A1
- Status: Published application
- Kind: A1
- Application number: 17/739,937
- Filed: 2022-05-09
- Published: 2022-09-08
- Earliest claimed: 2019-06-03
- Assignees: Memjet Technology Limited
- Applicants: Memjet Technology Limited
- Inventors: Nicolas ARNAL; Troy Pasiola QUIMPO; Angus NORTH
- Web page: https://patentgrep.com/patent/US20220285201A1

## CPC

- B41J 2/16: Production of nozzles
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- B41J 2/1623: {bonding and adhesion}
- B41J 2/1628: {dry etching}
- B41J 2/1631: {photolithography}
- B41J 2/1632: {machining}
- B41J 2/1635: {dividing the wafer into individual chips}
- H10P 72/7442: {Separation by peeling}
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A wafer assembly for use in a MEMS fabrication process. The wafer package includes: a MEMS wafer having a first side and an opposite second side; a silicone-free peel tape releasably attached to the first side of the wafer; a wafer bonding tape attached to the peel tape; and a carrier substrate releasably attached to the first wafer bonding tape.

## Claims

### Claim 1

A wafer assembly for use in a MEMS fabrication process, the wafer package comprising:
a MEMS wafer having a first side and an opposite second side;
a silicone-free peel tape releasably attached to the first side of the wafer;
a first wafer bonding tape attached to the peel tape; and
a first carrier substrate releasably attached to the first wafer bonding tape.

### Claim 2 (depends on 1)

The wafer assembly of claim 1, wherein the first wafer bonding tape contains silicon.

### Claim 3 (depends on 1)

The wafer assembly of claim 1, wherein the MEMS wafer comprises MEMS inkjet devices.

### Claim 4 (depends on 1)

The wafer assembly of claim 1 wherein the first side of the MEMS wafer has a plurality of inkjet nozzles.

### Claim 5 (depends on 1)

The wafer assembly of claim 1, further comprising:
a second wafer bonding tape attached to the second side of the wafer; and
a second carrier substrate releasably attached to the second wafer bonding tape.

### Claim 6 (depends on 5)

The wafer assembly of claim 5, wherein the second wafer bonding tape is different than the first wafer bonding tape.

### Claim 7 (depends on 5)

The wafer assembly of claim 5, wherein the first and second wafer bonding tapes are selected from the group consisting of: UV-release tape and thermal-release tape.