Hot-melt adhesive and method for producing bonded article

Abstract

A hot-melt adhesive comprising a thermoplastic resin and a first crystalline material, wherein when in differential scanning calorimetric measurement of the hot-melt adhesive, Tc (° C.) is a peak temperature of the highest peak of exothermic peaks observed in a temperature reduction process at 10° C./min following heating to 150° C. and Tm (° C.) is a peak temperature of the highest peak of endothermic peaks observed in a temperature increasing process at 10° C./min following the temperature reduction process, Tm-Tc is 20.0 to 70.0° C., and a tetrahydrofuran-soluble matter of the hot-melt adhesive has a weight-average molecular weight Mw, as measured by gel permeation chromatography, of 100,000 to 400,000.

Dependencies are inferred from the claim text.