Method of making a molded interconnect device
AssigneeMolex Incorporated
InventorsTsuey Choo CHANG, Steven ZEILINGER, Hyun-Jong KO, Patrick RILEY, SukMin KANG
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Abstract
A method of forming a molded interconnect device (MID) is provided. The method includes the steps of performing a molding stage, performing a circuit forming stage, and performing a plate stage. As a part of the molding stage, a palladium-catalyzed material is injection molded into a palladium-catalyzed substrate of a desired shape. As a part of the circuit forming stage, both a metallization step and a circuit patterning step are performed. As a part of the plating stage, both an electrolytic plating step and a circuit isolation step are performed.
Claims22
A method of forming a molded interconnect device (MID), the method comprising the steps of:
- a) performing a molding stage, wherein a palladium-catalyzed material is injection molded into a palladium-catalyzed substrate of a desired shape;
- b) performing a circuit forming stage, wherein
- b1) a metallization step is performed, and
- b2) a circuit patterning step is performed;
- and
- c) performing a plating stage, wherein
- c1) an electrolytic plating step is performed, and
- c2) a circuit isolation step is performed to provide the MID.
A method of forming a molded interconnect device (MID), the method comprising the steps of:
- a) injection molding a palladium-catalyzed material into a palladium-catalyzed substrate of a desired shape;
- b) forming a thin copper film over exposed surfaces of the palladium-catalyzed substrate;
- c) removing some of the copper film from the palladium-catalyzed substrate to provide first and second portions of the copper film and at least one exposed portion of the palladium-catalyzed substrate, the first and second portions of the copper film being separated from one another by the at least one exposed portion of the palladium-catalyzed substrate;
- d) electrolytically plating the first portion of the copper film to form a metallic-plated first portion;
- and
- e) removing the second portion of the copper film to provide the MID.
A method of forming a molded interconnect device (MID), the method comprising the steps of:
- a) injection molding a palladium-catalyzed material into a palladium-catalyzed substrate of a desired shape;
- b) forming a thin copper film over exposed surfaces of the palladium-catalyzed substrate;
- c) removing some of the copper film from the palladium-catalyzed substrate to provide first, second and third portions of the copper film, the second portion of the copper film connecting the first portion of the copper film to the third portion of the copper film;
- d) electrolytically plating the first, second and third portions of the copper film to form metallic-plated first, second and third portions;
- and
- e) removing the metallic-plated second portion in order to isolate the metallic-plated first portion from the metallic-plated third portion to provide the MID.
Dependencies are inferred from the claim text.