Photosensitive resin composition, photosensitive resin film, method for producing cured product, laminate, and electronic component
AssigneeShowa Denko Materials Co., Ltd.
InventorsMao NARITA, Keishi ONO, Tatsuhiko ARAI, Naoto KURODA
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Abstract
A photosensitive resin composition containing: a component (A) which is a high molecular weight compound having a photopolymerizable functional group and a carbon-nitrogen bond; a component (B) which is a low molecular weight compound having a photopolymerizable functional group; a component (C) which is a photopolymerization initiator; and a component (D) which is a triazole-based compound.
Claims32
A photosensitive resin composition comprising:
- a component (A) which is a high molecular weight compound having a photopolymerizable functional group and a carbon-nitrogen bond;
- a component (B) which is a low molecular weight compound having a photopolymerizable functional group;
- a component (C) which is a photopolymerization initiator;
- and
- a component (D) which is a triazole-based compound.
The method according to 21, further comprising heat-treating the photosensitive layer after the photosensitive layer is provided on a substrate.
Dependencies are inferred from the claim text.