Electro acoustic filter component and method of manufacturing to reduce influence of chipping
AssigneeRf360 Europe GmbH
InventorThomas KAUSCHKE
Life of this patent
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Abstract
An electro acoustic filter component with improved acoustic and/or electro acoustic performance is provided. The component comprises a piezoelectric material (PM) the sides of which are plane and preferably free from chipping defects. The piezoelectric material may be arranged above a carrier substrate (CS). A functional layer (FL) with plane sides may be arranged above an electrode structure (ES) as trimming, TCF or passivation layer. In the manufacturing method the piezoelectric material and the functional layer are removed from the dicing line, such that no chipping occurs for these layers.
Claims14
An electro acoustic filter component, comprising:
- a piezoelectric material in a piezoelectric layer,
- an electrode structure in an electrode layer arranged on the piezoelectric layer;
- and
- a cavity above the electrode structure,
- wherein sides of the piezoelectric material are plane.
A method of manufacturing an electro acoustic filter component, comprising:
- providing a wafer material as a material for carrier substrates;
- arranging a piezoelectric material on or above the wafer material;
- structuring an electrode structure on the piezoelectric material;
- and
- dicing the wafer material into individual pieces,
- wherein when dicing the wafer material is free from the piezoelectric material at the dicing positions.
Dependencies are inferred from the claim text.