Chassis structures and interconnections for lighter-than-air platforms
AssigneeLoon LLC
InventorsWoodruff Phillips, Carey Hijmans
Life of this patent
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AssigneeLoon LLC
InventorsWoodruff Phillips, Carey Hijmans
Estimating the term…
Aspects of the technology relate to lighter-than-air (LTA) high altitude platforms configured to operate in the stratosphere. Such platforms can generate operate for weeks, months or longer. Shaped envelope LTA platforms may support a payload that provides telecommunications and/or other services to remote regions around the world. The payload may be arranged with other components on a modular bus-type chassis. One or more components may be moveable along the chassis to change the pitch of the vehicle for more effective flight operation. The modular chassis may include a truss configuration assembled from one or more subunits. The subunits may be preassembled with different equipment packages. Trusses formed using sets of struts may have two or more struts terminating at one interconnection node. Node connection elements, such as compound dovetail interconnects, facilitate a reliable, repeatable and quick mounting method for structural interconnections, which can lead to faster assembly and disassembly times.
A lighter-than-air (LTA) high altitude platform (HAP) configured for operation in the stratosphere, comprising:
A lighter-than-air (LTA) high altitude platform (HAP) kit, the kit comprising:
A compound dovetail connector assembly, comprising:
Dependencies are inferred from the claim text.