2D & 3D RF Lumped Element Devices for RF System in a Package Photoactive Glass Substrates

A method for creating a system-in-package formed in or on photodefinable glass comprising:

• providing a photodefinable glass substrate;
• masking a design layout comprising one or more structures to form one or more integrated lumped element devices as the system-in-package on or in a photodefinable glass substrate;
• transforming at least a portion of the photodefinable glass substrate to a crystalline material to form a glass-crystalline substrate;
• etching the glass-crystalline substrate with an etchant solution to form one or more channels in the glass-crystalline substrate;
• depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate exposed during the etching step to enable electroplating of copper to fill the one or more channels and to deposit the copper on the surface of the photodefinable glass to form the one or more integrated lumped element devices;
• and
• electroplating the copper to fill the one or more channels and to deposit copper on the surface of the photodefinable glass to form the one or more integrated lumped element devices.