Signal isolator having at least one isolation island
AssigneeAllegro MicroSystems, LLC
InventorsRobert A. Briano, Alejandro Gabriel Milesi
Life of this patent
Estimating the term…
Abstract
Methods and apparatus for a signal isolator having reduced parasitics. An example embodiment, a signal isolator and include a first metal region electrically connected to a first die portion, a second die portion isolated from the first die portion, and a second metal region electrically connected to the second die portion. A third metal region can be electrically isolated from the first and second metal regions and a third die portion can be electrically isolated from the first, second and third metal regions. In embodiments, the first metal region, the second metal region, and the third metal region provide a first isolated signal path from the first die portion to the second die portion.
Claims20
A method for providing a signal isolator, comprising:
- electrically connecting a first die portion to a first metal region;
- isolating a second die portion from the first die portion;
- electrically connection a second metal region to the second die portion;
- electrically isolating a third metal region from the first and second metal regions;
- electrically isolating a third die portion from the first, second and third metal regions,
- wherein the first metal region, the second metal region, and the third metal region provide a first isolated signal path from the first die portion to the second die portion;
- and
- wherein the first metal region, the second metal region and the third die portion provide a second isolated signal path from the first die portion to the second die portion in parallel with the first isolated signal path.
A method, comprising:
- electrically connecting a first metal region to a first die portion of a signal isolator;
- isolating a second die portion from the first die portion;
- electrically connecting a second metal region to the second die portion;
- electrically isolating a third metal region from the first and second metal regions;
- electrically isolating a third die portion from the first, second and third metal regions;
- and
- electrically isolating a fourth die portion from the first, second and third metal regions, wherein the fourth die portion is isolated from the third die portion,
- wherein the first metal region, the second metal region, and the third metal region provide an isolated signal path from the first die portion to the second die portion,
- wherein the first die portion, the second die portion, the third die portion, and the fourth die portion are formed in a first layer, wherein the third die portion is electrically isolated from the fourth die portion, and
- wherein the first layer comprises an epitaxial layer.
A method, comprising:
- electrically connecting a first metal region to a first die portion of a signal isolator;
- isolating a second die portion from the first die portion;
- electrically connecting a second metal region to the second die portion;
- electrically isolating a third metal region from the first and second metal regions;
- electrically isolating a third die portion from the first, second and third metal regions,
- wherein the first metal region, the second metal region, and the third metal region provide a first isolated signal path from the first die portion to the second die portion, wherein the first isolated signal path does not include the third die portion;
- and
- wherein the first metal region, the second metal region and the third die portion provide a second isolated signal path from the first die portion to the second die portion in parallel with the first isolated signal path.
A method, comprising:
- electrically connecting a first metal region to a first die portion of a signal isolator;
- isolating a second die portion from the first die portion;
- electrically connecting a second metal region to the second die portion;
- electrically isolating a third metal region from the first and second metal regions;
- electrically isolating a third die portion from the first, second and third metal regions,
- wherein the first metal region, the second metal region, and the third metal region provide a first isolated signal path from the first die portion to the second die portion;
- and
- wherein the first metal region, the second metal region and the third die portion provide a second isolated signal path from the first die portion to the second die portion in parallel with the first isolated signal path, wherein the first, second, and third metal regions are on the same side of the third die portion.
Dependencies are inferred from the claim text.