Arrangement comprising an integrated circuit package and a heatsink element

Abstract

An arrangement (100) is provided. The arrangement comprises an integrated circuit package (2). The integrated circuit package comprises a first side (2a) which comprises interconnect elements, and a second side (2b) which is opposite to the first side (2a). The integrated circuit package further comprises at least one antenna element (25), and a heatsink element (1) arranged on the second side (2b) of the integrated circuit package (2). The heat sink element comprises at least one passage (10). The at least one passage (10) extends through the heatsink element (1). A first opening (13) of the at least one passage (10) is arranged at a respective antenna element (25) of the at least one antenna element. The at least one passage (10) is configured to increase the gain of the respective antenna element (25).

Dependencies are inferred from the claim text.