Wiring board and method for manufacturing wiring board

A wiring board, comprising:

• a substrate having a first elastic modulus, the substrate including a first surface and a second surface positioned on the opposite side of the first surface;
• wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board;
• and
• a reinforcing member having a second elastic modulus greater than the first elastic modulus, the reinforcing member at least including a first reinforcing part that is positioned on the first surface side of the substrate or on the second surface side of the substrate and that at least partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate,
• wherein the wiring includes a section that does not overlap the reinforcing member when viewed along the normal direction of the first surface and that has a meandering shape section including pluralities of peaks and valleys aligned along a planar direction of the first surface of the substrate,
• wherein the first surface side of the substrate includes peaks and valleys overlapping the meandering shape section,
• wherein the second surface side of the substrate includes peaks and valleys overlapping the meandering shape section, and
• wherein the periodicity of peaks and valleys on the second surface of the substrate is greater than the periodicity of peaks and valleys on the first surface of the substrate.

A wiring board, comprising:

• a substrate having a first elastic modulus, the substrate including a first surface and a second surface positioned on the opposite side of the first surface;
• wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board;
• and
• a reinforcing member having a second elastic modulus greater than the first elastic modulus, the reinforcing member at least including a first reinforcing part that is positioned on the first surface side of the substrate or on the second surface side of the substrate and that at least partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate,
• wherein the wiring includes a section that does not overlap the reinforcing member when viewed along the normal direction of the first surface and that has a meandering shape section including pluralities of peaks and valleys aligned along a planar direction of the first surface of the substrate,
• wherein the first surface side of the substrate includes peaks and valleys overlapping the meandering shape section,
• wherein the second surface side of the substrate includes peaks and valleys overlapping the meandering shape section, and
• wherein, when the periodicity of peaks and valleys on the first surface of the substrate is F, the positions of peaks and valleys on the second surface of the substrate are displaced from the positions of the peaks and the valleys on the first surface of the substrate.

A method for manufacturing a wiring board, the method comprising:

• a first step of applying tensile stress to a substrate so as to extend the substrate, the substrate having a first elastic modulus and including a first surface, and a second surface positioned on the opposite side of the first surface;
• a second step of providing wiring on the first surface side of the substrate which is in the extended state;
• and
• a third step of removing the tensile stress from the substrate,
• wherein the wiring board is provided with a reinforcing member having a second elastic modulus greater than the first elastic modulus, the reinforcing member at least including a first reinforcing part positioned on the first surface side of the substrate or on the second surface side of the substrate,
• wherein, after the tensile stress has been removed from the substrate, the wiring includes a section that does not overlap the reinforcing member when viewed along the normal direction of the first surface and that has a meandering shape section including pluralities of peaks and valleys aligned along a planar direction of the first surface of the substrate,
• wherein the first surface side of the substrate includes peaks and valleys overlapping the meandering shape section, and
• wherein the second surface side of the substrate includes peaks and valleys overlapping the meandering shape section.