Moisture-curable hot-melt adhesive composition, bonded object, and garment
AssigneeShowa Denko Materials Co., Ltd.
InventorsShujie QU, Souichirou KOMIYA, Takuya IMAI, Kazuyuki MAGOME, Junichi KAMEI
Life of this patent
Estimating the term…
Abstract
A moisture-curable hot-melt adhesive composition is disclosed. This moisture-curable hot-melt adhesive composition contains: a urethane prepolymer including a polymer chain, which includes a structural unit derived from a polyol and a structural unit derived from a polyisocyanate, and having two or more isocyanate groups; and a modified urethane prepolymer including a polymer chain, which includes a structural unit derived from a polyol and a structural unit derived from a polyisocyanate, and having one or more isocyanate groups modified with a castor oil monool.
Claims5
A moisture-curable hot-melt adhesive composition comprising:
- a urethane prepolymer including a polymer chain, which includes a structural unit derived from a polyol and a structural unit derived from a polyisocyanate, and having two or more isocyanate groups;
- and
- a modified urethane prepolymer including a polymer chain, which includes a structural unit derived from a polyol and a structural unit derived from a polyisocyanate, and having one or more isocyanate groups modified with a castor oil monool.
Dependencies are inferred from the claim text.