Power electronics systems comprising a two-phase cold plate housing a vaporization structure

A power electronics system comprising:

• a two-phase cold plate and one or more heat generating devices thermally coupled to the two-phase cold plate, wherein:
• the two-phase cold plate comprises a manifold body having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway housed within the manifold body;
• a vaporization structure is housed within the manifold body such that the fluid pathway is disposed over the vaporization structure, the vaporization structure comprising a cavity cover, a porous surface, a vapor cavity disposed between the cavity cover and the porous surface, and one or more porous feeding posts extending between the cavity cover and the porous surface, wherein:
• the one or more porous feeding posts fluidly coupled the fluid pathway with the porous surface of the vaporization structure;
• and
• the porous surface comprises a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the vaporization structure.

A method of removing heat from one or more heat generating devices, the method comprising:

• directing a cooling fluid through a fluid inlet of a manifold body of a two-phase cold plate and into a fluid pathway disposed in the manifold body, the two-phase cold plate further comprising a vaporization structure fluidly coupled to the fluid pathway, wherein
• the cooling fluid flows along the fluid pathway thereby removing heat from the one or more heat generating devices thermally coupled to the two-phase cold plate;
• and
• at least a portion of the cooling fluid enters one or more porous feeding posts of the vaporization structure that fluidly couple the fluid pathway of with a vapor cavity of the vaporization structure thereby vaporizing at least a portion of the cooling fluid at a plurality of nucleation sites within the vaporization structure such that vapor flows into the vapor cavity and removes heat from the one or more heat generating devices thermally coupled to the two-phase cold plate;
• and
• removing heated cooling fluid from a fluid outlet of the manifold body.