Back to results
US 2022/0192053 A1Published application
Cooling structure
AssigneeShowa Denko Materials Co., Ltd.
InventorsHiroaki SHOUDA, Takahiro YAMASHITA, Kazutake FUJISAWA
Life of this patent
Estimating the term…
Abstract
A cooling structure including a flow path configuration member made of resin and forming a flow path through which a refrigerant flows, a heat diffuser having a plate shape, including a metal, and being embedded in the flow path configuration member or joined to the flow path configuration member, and one or more cooling fins extending from the heat diffuser into the flow path and having a surface made of resin.
Claims20
A cooling structure, comprising:
- a flow path configuration member made of resin and forming a flow path through which a refrigerant flows;
- a heat diffuser having a plate shape, including a metal, and being embedded in the flow path configuration member or joined to the flow path configuration member;
- and
- one or more cooling fins extending from the heat diffuser into the flow path and having a surface made of resin.
1 more element
Dependencies are inferred from the claim text.